Diamond Heat Spreader Regions for 3D Package Cooling
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Solution Overview
Problem
Cooling 3D and 2.5D packaged semiconductor devices remains a challenge, leading to overheating issues that negatively impact performance and lifespan.
Innovation Solution
Incorporating thermal dissipation regions comprising diamond into heat spreaders within semiconductor device packages to enhance heat transfer capabilities.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If 3D or 2.5D integration of semiconductor devices is implemented to increase transistor device density, then computing power and efficiency in smaller form factors are improved, but heat dissipation becomes more difficult leading to overheating issues
Solution Approach 1:
The heat spreader incorporates regions with different thermal conductivities in different locations. High thermal conductivity regions (first regions) are positioned in areas requiring superior heat dissipation, while moderate thermal conductivity regions (second regions) are positioned in other areas. This local differentiation optimizes heat dissipation performance in critical zones without compromising overall thermal management.
Solution Approach 2:
The heat spreader is constructed as a composite structure combining materials with different thermal properties. The first regions utilize materials or structures with high thermal conductivity to efficiently conduct heat away from hot spots, while the second regions use materials with moderate thermal conductivity. This composite approach enables the heat spreader to simultaneously address localized heat generation and overall thermal distribution.
2Temperature
If conventional heat spreader materials are used, then manufacturing simplicity is maintained, but heat transfer capability is insufficient to address overheating issues
Solution Approach 1:
Rather than uniformly increasing complexity throughout the entire heat spreader, the invention applies enhanced thermal conductivity regions only where needed. The first regions with high thermal conductivity are strategically positioned to address specific heat dissipation requirements, while the second regions maintain simpler construction with moderate thermal conductivity. This localized enhancement achieves superior heat transfer capability without proportionally increasing overall device complexity.
Solution Approach 2:
The invention modifies the thermal conductivity parameter of the heat spreader material in specific regions. By changing the material composition or structural parameters in the first regions to achieve high thermal conductivity, while maintaining moderate parameters in the second regions, the heat spreader achieves enhanced overall heat transfer capability. This parameter differentiation allows optimization of heat transfer performance without requiring complete redesign of the entire structure.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The integration of diamond thermal dissipation regions improves heat transfer, effectively addressing overheating issues and enhancing the performance and lifespan of semiconductor devices.
Implementation Method 1
Incorporating thermal dissipation regions comprising diamond into heat spreaders within semiconductor device packages to enhance heat transfer capabilities
Data Source
AI summary
Assemblies comprising semiconductor devices, packages, and heat spreaders are provided. The heat spreaders comprise heat dissipation regions comprising diamond. The diamond can be, for example, a solid diamond plate or a composite comprising diamond particles. Methods for manufacturing assemblies comprising heat spreaders that include heat dissipation regions comprising diamond are also provided.