Diamond Microchannel Heat Spreader for Hot Spot Control
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Solution Overview
Problem
Traditional heat spreading solutions, such as metal heat sinks and thermal interface materials, have limitations in thermal conductivity and heat dissipation capabilities, leading to uneven heat dissipation and the formation of hot spots that exceed recommended operating temperatures, reducing the lifespan of electronic devices.
Innovation Solution
A heat spreading device utilizing a diamond substrate with irregular and nonlinear microchannels on one side and thermal vias on the opposite side, configured to efficiently transfer heat from heat generating sources, enhancing thermal management and reducing material usage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If traditional metal heat sinks and thermal interface materials are used, then device structure is simple and manufacturing is easy, but thermal conductivity is insufficient and hot spots form
Solution Approach 1:
The patent changes the material parameter from traditional metals to diamond, which has superior thermal conductivity. This parameter change enables more effective heat dissipation and prevents hot spot formation, directly resolving the contradiction between temperature control and device reliability
Solution Approach 2:
The patent employs diamond composite structures with microchannels, combining the high thermal conductivity of diamond with efficient heat transfer pathways. This composite approach enhances overall thermal performance while maintaining structural integrity, addressing both temperature control and reliability requirements
2Reliability
If diamond substrate with microchannels is used, then thermal conductivity is enhanced and hot spots are prevented, but device complexity increases
Solution Approach 1:
The diamond substrate is segmented with microchannels that divide and distribute heat flow paths. This segmentation approach enhances heat dissipation efficiency by creating multiple thermal pathways, preventing hot spots while managing the complexity through systematic channel distribution
Solution Approach 2:
The patent utilizes the porous microchannel structure within the diamond substrate to enhance heat transfer surface area and improve thermal management. This porous approach increases reliability through better heat dissipation while containing complexity within the substrate structure
3Productivity
If irregular and nonlinear microchannels are used, then heat dissipation capability is improved, but manufacturing precision requirements increase
Solution Approach 1:
The patent employs irregular and nonlinear (curved) microchannel geometries instead of straight channels. These curved pathways improve heat dissipation capability by enhancing fluid flow characteristics and heat transfer efficiency, while the design balances manufacturing precision requirements through feasible curvature radii
4Use of energy by moving object
If thermal vias are provided on the opposite side, then heat transfer efficiency is enhanced, but device complexity increases
Solution Approach 1:
The patent extracts heat from the heat generating source through thermal vias located on the opposite side of the diamond substrate. This extraction approach improves heat transfer efficiency by providing direct thermal pathways from the heat source through the diamond to the cooling system, while managing complexity through strategic via placement
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The diamond substrate with microchannels and thermal vias achieves enhanced thermal performance, maintaining optimal operating temperatures and preventing hot spots, resulting in improved device reliability and longevity.
Implementation Method 1
Each of the one or more thermal vias is configured to be connected to one or more heat generating sources for transferring a heat generated from the one or more heat generating sources to the diamond substrate
Implementation Method 2
The heat spreader is configured to dissipate heat from the heat generating source to an outside medium. The heat spreader typically dissipates heat by conduction, transferring heat from one solid to another
Implementation Method 3
one or more irregular and/or nonlinear microchannels provided on a first side of the diamond substrate
Data Source
Figure 1
Figure 2A~2D
Figure 2E~2H
AI summary
A heat spreading device (100) is disclosed. The heat spreading device (100) includes a diamond substrate (108) comprising one or more irregular and/or nonlinear microchannels (112) provided on a first side (114) of the diamond substrate (108). The heat spreading device (100) further includes one or more thermal vias (116) provided on a second side (118) of the diamond substrate (108) opposite to the one or more irregular and/or nonlinear microchannels (112). The one or more thermal vias (116) are configured to be connected to one or more heat generating sources (104) for transferring a heat generated from the one or more heat generating sources (104) to the diamond substrate (108).