Diamond-Photonic Device Optical Coupling via Adhesive

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Solution Overview

Problem

Current methods fail to effectively optically couple diamond structures with photonic devices fabricated from semiconductor materials, hindering the realization of scalable quantum computing architectures.

Innovation Solution

A method involving the deposition of semiconductor materials on diamond structures, forming photonic devices, and adhering them using an adhesive substance to achieve optical coupling, allowing for efficient inter-conversion between photonic and spin qubits.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If diamond structures are coupled with photonic devices, then quantum information processing efficiency is improved, but manufacturing complexity increases

Engineering Contradiction:

Improvequantum information processing efficiencyVSAvoidmanufacturing complexity

Core Design Contradiction:

ProductivityVSDevice complexity

Solution Approach 1:

The patent segments the quantum computing system into distinct functional modules: diamond structures with color centers for quantum processing, separate photonic devices for light manipulation, and adhesive layers for coupling. This modular segmentation allows each component to be optimized and manufactured independently, reducing overall manufacturing complexity while maintaining quantum information processing efficiency.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The patent introduces an adhesive substance as an intermediary layer between the diamond structure and the photonic device. This intermediary enables effective optical coupling and mechanical bonding, facilitating strong interaction between the two components without requiring direct integration, thereby simplifying the manufacturing process while achieving the desired quantum information processing performance.

Inventive Principle:

Principle #24Intermediary (Mediator)

2Strength

If adhesive substances are used to couple photonic devices to diamond structures, then optical coupling strength is improved, but material compatibility challenges arise

Engineering Contradiction:

Improveoptical coupling strengthVSAvoidmaterial compatibility

Core Design Contradiction:

StrengthVSEase of manufacture

Solution Approach 1:

The patent employs parameter changes in the adhesive substance, specifically adjusting its refractive index to match or bridge the optical properties of diamond and semiconductor materials. By optimizing the adhesive's optical parameters (refractive index, thickness), the patent achieves strong optical coupling while maintaining compatibility with both diamond and photonic device materials, resolving the material compatibility challenge.

Inventive Principle:

Principle #35Parameter changes

3Adaptability or versatility

If semiconductor materials are deposited on diamond structures, then photonic device integration is improved, but thermal stress issues worsen

Engineering Contradiction:

Improvephotonic device integrationVSAvoidthermal stress

Core Design Contradiction:

Adaptability or versatilityVSObject-affected harmful factors

Solution Approach 1:

The patent applies local quality by creating a gradient or localized variation in the adhesive layer properties at the interface between diamond and semiconductor materials. This localized adaptation of the adhesive's thermal and mechanical properties helps accommodate the thermal expansion mismatch between diamond and semiconductor, reducing thermal stress while maintaining effective photonic device integration.

Inventive Principle:

Principle #3Local quality

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

Enables strong coupling between diamond color centers and photonic devices, facilitating efficient quantum information processing and the development of scalable quantum computing architectures.

Implementation Method 1

an adhesive substance that adheres the photonic device to the diamond structure

Methodology Applied

Scientific EffectAdhesion: Adhesive

Implementation Method 2

depositing a semiconductor material on the diamond structure

Methodology Applied

Scientific EffectDeposition: Deposition (physical)

Data Source

PatentUS8039845B2Methods for coupling diamond structures to photonic devices

Publication Date: 2011.10.18 HEWLETT PACKARD ENTERPRISE DEV LP

AI summary

Various embodiments of the present invention are directed to methods for coupling semiconductor-based photonic devices to diamond. In one embodiment of the present invention, a photonic device is optically coupled with a diamond structure. The photonic device comprises a semiconductor material and is optically coupled with the diamond structure with an adhesive substance that adheres the photonic device to the diamond structure. A method for coupling the photonic device with the diamond structure is also provided. The method comprises: depositing a semiconductor material on the diamond structure; forming the photonic device in the semiconductor material so that the photonic device couples with the diamond structure; and adhering the photonic device to the diamond structure.