Diamond Resin Composition for Heat Dissipation and Flowability
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Solution Overview
Problem
Conventional heat-dissipating compounds struggle to achieve both high heat dissipation performance and flowability due to the trade-off between dense filler packing and resin workability.
Innovation Solution
A resin composition comprising a first filler of octahedral or hexoctahedral diamond and a second filler with specific particle size and shape ratios, along with a matrix resin, achieving a high volume percentage of fillers to enhance both heat dissipation and flowability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If the filler is densely packed to enhance heat dissipation properties, then the thermal conductivity is improved, but the flowability of the compound is lost and workability reduces
Solution Approach 1:
The patent applies parameter changes by precisely controlling the volume-average particle diameters of fillers (first filler: 55-200 μm, second filler: 10-55 μm) and their volume ratios (first filler: 20-70 vol%, second filler: 5-80 vol%). This optimization of physical parameters enables dense filler packing for high thermal conductivity while maintaining adequate flowability for fabrication
Solution Approach 2:
The patent uses composite materials by combining two different types of fillers (diamond and aluminum nitride or aluminum oxide) with different particle sizes and properties. This composite approach allows the larger diamond particles to provide thermal conductivity while the smaller aluminum nitride/oxide particles fill interstices, achieving dense packing without sacrificing flowability
2Temperature
If the volume percentage of fillers is increased to improve heat dissipation, then the thermal conductivity is enhanced, but the resin workability deteriorates
Solution Approach 1:
The patent optimizes the volume percentage of fillers within specific ranges (total fillers: 80-95 vol%, diamond: 20-70 vol%, aluminum nitride: 5-80 vol%) to achieve high thermal conductivity while maintaining resin workability. This controlled parameter adjustment ensures adequate resin content for proper workability despite high filler loading
Solution Approach 2:
The composite filler system allows high total filler content (80-95 vol%) to be achieved while maintaining workability. The combination of diamond and aluminum nitride/oxide particles with different sizes creates a packed structure that maximizes thermal conductivity without excessive viscosity increase, preserving resin processability
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The composition enables a heat-dissipating member with excellent heat dissipation properties and flowability, suitable for electronic devices, by optimizing filler distribution and resin compatibility.
Implementation Method 1
a resin composition, comprising: a first filler that is at least one selected from the group consisting of an octahedral diamond and an hexoctahedral diamond... high heat-dissipating compound having high heat dissipation properties... the thermal conductivity
Data Source
AI summary
There is provided a resin composition containing a first filler that is at least one selected from the group consisting of octahedral diamond and hexoctahedral diamond, a second filler different from the first filler, and a matrix resin, wherein the volume-average particle diameter for primary particle diameter of the first filler is larger than the volume-average particle diameter for primary particle diameter of the second filler; the volume percentage of the whole of the fillers is higher than 80% by volume, and the volume percentage of the diamond is higher than 20% by volume; and the volume-average particle diameter for primary particle diameter of the first filler is 55 µm or larger.