Diamond Saw Tooth Laser Machining With Circular-Arc Scan Paths

Resolve Bottlenecks,
Find Innovative Solutions
Generate Solutions

Solution Overview

Problem

Existing methods for machining sawteeth of diamond circular saw blades face issues such as low precision, inefficient machining due to non-conductive PCD layer, and challenges in accurately projecting laser patterns onto diverse rear angle surfaces, leading to potential burns and incomplete machining.

Innovation Solution

A circular arc optical path sawtooth machining process using a laser machining device with a scanning pattern of elongated grooves with arcs at both ends, allowing precise and efficient machining of rear angle and side surfaces by adjusting laser beam angles and positions to uniformly grind the blank volume in one pass.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If laser scans back and forth along a corresponding scanning pattern to machine the side surface of the sawtooth, then the laser can cover the entire scanning pattern area, but the laser focus has short residence time at turning points leading to burns and reduced machining precision

Engineering Contradiction:
Improvemachining efficiencyVSAvoidmachining precision
Core Design Contradiction:
ProductivityVSManufacturing precision

Solution Approach 1:

The patent applies curvature by replacing traditional straight-line scanning paths with circular arc segments. The scanning pattern consists of multiple circular arcs with different radii that smoothly connect to form a closed loop, allowing the laser to maintain uniform speed without abrupt direction changes. This curved path design eliminates the acceleration and deceleration phases at turning points, preventing burns while maintaining machining efficiency.

Inventive Principle:
Principle #14Spheroidality (Curvature)

2Device complexity

If a circular aperture laser is used to machine the sawtooth, then the machining process is simple, but the circular aperture cannot accurately machine inflection points and complex shapes of the rear angle surface

Engineering Contradiction:
Improvemachining process simplicityVSAvoidshape accuracy
Core Design Contradiction:
Device complexityVSManufacturing precision

Solution Approach 1:

The patent segments the scanning pattern into multiple circular arc segments with different radii. Each arc segment is designed to specifically address certain features of the sawtooth geometry, particularly the inflection points and complex contours of the rear angle surface. This segmentation allows precise control over the laser path to accurately machine complex shapes while maintaining a relatively simple overall process.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The patent employs circular arcs of varying radii to match the curvature of the sawtooth features being machined. By using arcs with different radii, the laser can accurately follow the complex contours and inflection points of the rear angle surface, achieving high shape accuracy that a single circular aperture cannot provide.

Inventive Principle:
Principle #14Spheroidality (Curvature)

3Area of stationary object

If the laser moves from point P1 to P2 and accelerates then decelerates at each point, then the laser can cover the scanning area, but the short residence time at turning points causes burns and reduces product quality

Engineering Contradiction:
Improvescanning pattern coverageVSAvoidlaser burns
Core Design Contradiction:
Area of stationary objectVSObject-affected harmful factors

Solution Approach 1:

The patent ensures continuous useful action by designing a closed-loop scanning pattern composed of smoothly connected circular arcs. The laser travels continuously along this path without stopping or slowing down at turning points, maintaining constant material removal rate. This continuity eliminates the harmful effect of short residence time at corners, preventing burns while ensuring complete coverage of the scanning pattern area.

Inventive Principle:
Principle #20Continuity of useful action

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The process ensures high precision and efficiency by avoiding laser acceleration/deceleration, preventing burns, and effectively machining diverse rear angle and side surfaces, including inflection points, thus improving product quality and flexibility.

Implementation Method 1

laser beam emitted by the laser galvanometer falls on an upper end of a surface of a sawtooth to be machined

Methodology Applied
Scientific EffectLaser ablation: Laser Ablation

Implementation Method 2

laser beam grinds from one end of the surface of the sawtooth to be machined to the other end along the scanning path

Methodology Applied
Scientific EffectLaser heating: Laser

Data Source

PatentEP4606505A1Process for machining saw teeth by means of circular-arc light path
Publication Date: 2025.08.27 LINYI YOUCHENG SAW TECH SERVICE CO LTD
  • EP4606505A1 patent drawingFigure 1
  • EP4606505A1 patent drawingFigure 2
  • EP4606505A1 patent drawingFigure 3~4

AI summary

The invention discloses a circular arc optical path sawtooth machining process, and belongs to the field of machining of sawteeth of diamond circular saw blades. The circular arc optical path sawtooth machining process mainly includes: adjusting a scanning pattern of a laser galvanometer to an elongated groove-shaped structure with arcs at both ends, and adjusting the position and size of the scanning pattern according to the blank volume on the surface of the sawtooth to be machined, such that the scanning pattern covers a grinding width A of the blank volume, thereby ensuring that during grinding, each layer of the scanning pattern is arranged to grind away all of the grinding width contained in the blank volume at one time. the machining process may be used for the machining of rear angle surfaces of the sawteeth with internal corners.