Diamond-Layout Semiconductor Tool for Compact High-Density Processing
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Solution Overview
Problem
Conventional semiconductor-processing tools have a limited ability to reduce their footprint while maintaining a high number of processing stations, leading to increased space requirements in fabrication environments.
Innovation Solution
The implementation of a semiconductor-processing tool with multiple multi-station modules, where some processing stations are arranged in a diamond-shaped configuration and coupled with a vacuum-transfer module containing vacuum-transfer robots, allowing for a more compact design by reducing the bump-out region and incorporating additional processing stations within the vacuum-transfer module.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If processing stations are arranged in a conventional square configuration, then the layout is simple and easy to manufacture, but the footprint area is large and packing density is low
Solution Approach 1:
The patent applies asymmetry by transitioning from a conventional square arrangement to a diamond-shaped arrangement of processing stations. This asymmetric configuration optimizes space utilization and reduces the overall footprint area while maintaining manufacturing feasibility through systematic reconfiguration of the station layout.
Solution Approach 2:
The patent utilizes dimensional optimization by arranging processing stations in a diamond pattern that better utilizes two-dimensional space. This configuration reduces the bounding box area required for the same number of processing stations compared to a square arrangement, effectively solving the footprint reduction problem.
2Area of stationary object
If the tool footprint is reduced through compact arrangement, then space efficiency improves, but the number of processing stations must be reduced
Solution Approach 1:
The patent merges the vacuum-transfer module with additional processing stations, creating a multi-functional integrated module. This allows the system to perform both substrate transfer and processing functions within the same spatial envelope, thereby increasing the number of processing stations without proportionally increasing the footprint area.
Solution Approach 2:
The vacuum-transfer module is designed to serve dual purposes: substrate transfer and substrate processing. By incorporating processing capabilities directly into the transfer module, the system achieves multi-functionality that increases productivity while maintaining compact footprint.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration increases the packing density of processing stations, reduces the overall footprint of the tool, and enhances substrate throughput by adding pre-clean, degas, and post-processing capabilities within the vacuum-transfer module.
Implementation Method 1
A vacuum-transfer module is coupled to each of the multi-station modules. The vacuum-transfer module has one or more vacuum-transfer robots to transfer substrates to and from at least one of the multiple processing stations.
Data Source
AI summary
Various examples include arrangements of semiconductor-processing tools. In one example, a semiconductor-processing tool includes multiple multi-station modules, each having multiple processing stations. At least some of the processing stations are organized in a diamond-shaped arrangement. A vacuum-transfer module is coupled to each of the multi-station modules. The vacuum-transfer module has one or more vacuum-transfer robots to transfer substrates to and from at least one of the multiple processing stations. At least one additional processing-station is located in the vacuum-transfer module. Other systems and apparatuses are disclosed.