Single-Crystal Diamond Substrate Delamination on (111) Planes
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing methods for processing single crystal diamond substrates, particularly those with a (111) orientation, suffer from high processing loss and inefficiencies, especially when converting bulk crystals or ingots into substrates for high-precision magnetic sensors.
Innovation Solution
A method involving the use of pulsed laser light to form a modified layer with graphite processing marks and cracks on the (111) surface of single crystal diamond, followed by spontaneous delamination to minimize processing loss.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If ion implantation is used to introduce defective layers for delamination, then delamination can be achieved, but high vacuum environment equipment is required and processing time is long
Solution Approach 1:
The patent replaces the mechanical/physical process of ion implantation with a laser-based process. Laser light is used to heat and graphitize the diamond surface, creating a modified layer that enables delamination without requiring vacuum equipment or ion implantation devices.
Solution Approach 2:
The patent changes the processing parameters by using laser heating to reach graphitization temperature (around 2000°C) locally at the surface, transforming the diamond structure into graphite. This parameter change (temperature and phase transformation) creates the modified layer needed for delamination without complex equipment.
2Productivity
If conventional cutting methods are used to slice diamond blocks, then substrates can be produced, but significant processing loss occurs as cutting margin
Solution Approach 1:
The patent performs preliminary action by creating the modified layer at the exact position where the substrate will be separated. This pre-processing step defines the precise separation plane, eliminating the need for additional cutting margins and maximizing material utilization.
Solution Approach 2:
The patent replaces mechanical cutting methods with a laser-based modification process. Instead of physically slicing through the diamond block with cutting tools that require margins, the laser creates a modified layer that enables clean separation at the precise desired location.
3Manufacturing precision
If polishing is used to process (111) oriented diamond blocks, then substrates can be obtained, but processing is especially difficult and time-consuming
Solution Approach 1:
The patent performs preliminary action by creating the modified layer at the precise depth and position before separation. This pre-defines the substrate thickness and separation plane, eliminating the need for time-consuming polishing operations to achieve the final dimensions and surface quality.
Solution Approach 2:
The patent utilizes phase transition from diamond to graphite through laser heating. This phase change creates a distinct modified layer with different properties that facilitates easy separation and eliminates the need for mechanical polishing to achieve the desired substrate quality.
4Loss of substance
If laser light is condensed to form modified layer, then processing loss is reduced, but precise control of laser condensation is required
Solution Approach 1:
The patent employs feedback control in the laser processing system to monitor and adjust the laser parameters in real-time. This ensures precise control of the modified layer depth and position, maintaining high manufacturing precision while minimizing processing loss through optimized laser condensation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach allows for the production of (111) substrates with reduced material loss, enhancing the yield and efficiency in manufacturing diamond substrates.
Implementation Method 1
radiating laser light on the upper surface of the block from the laser condensing unit and condensing the laser light inside the block
Implementation Method 2
forming a modified layer, which includes a processing mark of graphite
Implementation Method 3
a crack extending along a surface (111) around the processing mark
Implementation Method 4
spontaneous delamination with reduced thickness loss
Data Source
AI summary
A method of manufacturing a diamond substrate includes: a step of placing a laser condensing unit 190 configured to condense laser light B so as to face an upper surface 10a of a block 10 of single crystal diamond; and a step of forming a modified layer 20, which includes a processing mark 21b of graphite and a crack 22b extending along a surface (111) around the processing mark 21b, along the surface (111) of the single crystal diamond at a predetermined depth from an upper surface of the block by radiating the laser light B on the upper surface 10a of the block 10 from the laser condensing unit 190 under predetermined conditions and condensing the laser light B inside the block 10, and moving the laser condensing unit 190 and the block 10 in a relative manner two-dimensionally.