Diamond Heat Spreader Thermal Chuck for Microprocessor Hot Spots
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Solution Overview
Problem
The uneven power distribution in microprocessors leads to non-uniform temperature across the device, forming hot spots that exceed recommended operating temperatures, causing premature failures and complicating effective thermal management during testing.
Innovation Solution
A high-performance heatsink/thermal chuck with an integrated heat spreader made of diamond and microfluidic channels within a silicon carbide substrate, featuring high thermal conductivity and low thermal expansion, actively manages temperature by embedding heating elements to distribute and dissipate heat effectively.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If high test power is applied to increase parallelism and decrease test time, then productivity is improved, but temperature of hot spots increases beyond safe limits causing reliability deterioration
Solution Approach 1:
The patent segments the thermal management function by integrating separate heating elements and cooling channels within the thermal chuck structure. This allows independent control of heating and cooling zones, enabling precise temperature management during high-power testing without compromising device reliability
Solution Approach 2:
The patent changes the thermal parameters of the chuck by incorporating materials with high thermal conductivity and integrating active thermal control elements. This enables dynamic adjustment of temperature parameters during testing, maintaining safe operating temperatures even under high test power conditions
2Reliability
If active thermal management with heating and cooling is implemented, then temperature control capability is improved, but device complexity increases
Solution Approach 1:
The patent merges the heating elements, cooling channels, and temperature sensing capabilities into a single integrated thermal chuck structure. This consolidation provides comprehensive temperature control functionality while minimizing the increase in device complexity through unified design
Solution Approach 2:
The thermal chuck is designed with multi-functionality, serving as both a mechanical support structure and an active thermal management system. The integrated heating and cooling capabilities allow the same structure to perform multiple thermal control functions, reducing the need for separate components
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively reduces hot spot temperatures and uniform temperature distribution, enhancing thermal management capabilities to handle large heat fluxes and maintain device temperature, thereby improving test efficiency and reliability.
Implementation Method 1
a first layer comprising predominantly diamond, the first layer having a substantially planar first surface to receive an integrated circuit device under test
Implementation Method 2
an embedded heating element comprising metal in contact with or above at least a first portion of a second surface of the first layer opposite the first surface
Implementation Method 3
a heatsink comprising a crystalline material, the crystalline material comprising silicon and carbon, the heatsink comprising trenches distal from the substantially planar first surface of the first layer of diamond
Data Source
AI summary
Disclosed herein is a high-performance thermal chuck for enhanced thermal management of high-power integrated circuit (IC) devices. The disclosed high-performance thermal chuck provides active heating and cooling for post-manufacture device testing. A high-performance heatsink comprises microfluidic channels in a high thermal conductivity silicon carbide (SiC) body for providing enhanced active cooling of an IC device. A refractory heating element is embedded between an integrated heat spreader comprising diamond and the heatsink for providing active heating. The integrated heat spreader is bonded to the heatsink. Closely matched coefficients of thermal expansion between the diamond heat spreader and the heatsink mitigate thermally-induced warpage.