Diaphragm Circuit Layer Support for Reliable Capacitance Data
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Solution Overview
Problem
Conventional moving-coil speakers face reliability issues in capacitance data acquisition due to the breakage of leads on electrode plates caused by vibrations, leading to unreliable monitoring of vibration displacement.
Innovation Solution
A vibration diaphragm system comprising an annular support member, a first vibration diaphragm layer, and a circuit layer with a capacitance area and solder pads, where the circuit layer is fixedly connected to the support member and the diaphragm layer, ensuring the capacitance solder pad is supported and does not vibrate, thus preventing lead breakage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If a lead is disposed on the lower electrode plate of the capacitor to acquire capacitance data, then capacitance data acquisition is enabled, but the lead is easy to fracture due to vibration when the DOME and vibration diaphragm vibrate together
Solution Approach 1:
The patent extracts the harmful vibration from the capacitance measurement system by separating the lower electrode plate from the vibrating DOME. The lower electrode plate is repositioned to the housing (non-vibrating part) while the upper electrode plate remains on the DOME, thus removing the lead from the vibration zone and preventing fracture while maintaining capacitance measurement capability.
2Measurement precision
If the lower electrode plate is disposed on the DOME of the vibration diaphragm, then capacitance feedback of vibration displacement is achieved, but the lead on the electrode plate is easy to break due to vibration
Solution Approach 1:
The patent introduces the housing as an intermediary non-vibrating support structure for the lower electrode plate. This mediator allows the capacitance measurement system to function while isolating the lead from direct vibration exposure, as the lead now connects to a stationary component rather than a vibrating one.
3Adaptability or versatility
If the capacitance solder pad is not supported by the support member, then the circuit layer has flexibility, but the lead is prone to breakage due to vibration
Solution Approach 1:
The patent applies local quality by providing targeted support only at the capacitance solder pad location through the support member. This localized support prevents lead breakage at the critical connection point while maintaining the overall flexibility of the circuit layer for other functions, achieving a balance between rigidity where needed and flexibility where required.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution ensures reliable capacitance data acquisition by stabilizing the capacitance solder pad and lead, enhancing the connection strength between diaphragm layers and the circuit layer, thereby improving the overall reliability of data acquisition.
Implementation Method 1
there is a need to dispose a steel sheet on the upper housing of the speaker module housing to serve as an upper electrode plate of a capacitor, and to dispose another steel sheet on the DOME of the vibration diaphragm to serve as a lower electrode plate of the capacitor. When the moving-coil speaker works, the capacitance of the capacitor changes to feed back vibration displacement of the vibration diaphragm
Data Source
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AI summary
Disclosed in the present invention is a diaphragm and a manufacturing method for a diaphragm, the diaphragm comprising an annular support member, a first diaphragm layer and a circuit layer, the first diaphragm layer being fixedly connected to a support body of the annular support member, the circuit layer being positioned on the surface of a vibrating sound coil adjacent to the first diaphragm layer and being fixedly connected to the first diaphragm layer and the support body, the circuit layer being provided with a circuit area, a capacitance area, and a capacitance solder pad, the capacitance area being a capacitance electrode plate formed on the first diaphragm layer, the capacitance area being in communication with the circuit area by means of the capacitance solder pad, and the solder pad corresponding to the support body. In the present invention, the capacitance electrode plate is positioned directly on the circuit layer, the annular support member supports the first diaphragm layer and the circuit layer, and the solder pad corresponds to the support body, such that an acquisition lead connected to the capacitance solder pad will not break as a result of vibrating with the membrane, thus ensuring the reliability of capacitance data acquisition.