Loudspeaker Diaphragm Embedding Lead Wire to Stop Shell Collision
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Solution Overview
Problem
Conventional moving-coil speakers experience noise and vibration interference due to the collision of lead wires with the speaker shell, which affects the sound quality and freedom of diaphragm vibration.
Innovation Solution
A speaker diaphragm structure that encloses the lead wire within a lead wire enclosure portion and diaphragm layer, where the lead wire enclosure portion has a membrane part with support protrusions and a corrugated rim, and the diaphragm layer is injection-molded to completely embed the lead wire, preventing collisions and noise generation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If the lead wire extends from the speaker shell to the voice coil, then electrical connection is achieved, but the lead wire collides with the shell and generates noise
Solution Approach 1:
The lead wire is nested within the diaphragm layer structure. The injection molded diaphragm layer completely encloses the lead wire, embedding it within the diaphragm itself rather than having it extend externally. This nesting approach eliminates the collision noise while maintaining a relatively simple overall structure.
Solution Approach 2:
The injection molded material acts as an intermediary between the lead wire and the speaker shell. By encapsulating the lead wire in the diaphragm layer, this intermediary structure prevents direct contact and collision between the lead wire and the shell, thereby eliminating the noise generation mechanism.
2Reliability
If the lead wire is exposed, then electrical connection is accessible, but the lead wire pulls the voice coil and affects diaphragm vibration freedom
Solution Approach 1:
The lead wire is nested within the injection molded diaphragm layer, which completely encloses it. This embedding provides stable support and positioning for the lead wire, preventing it from pulling or displacing the voice coil during diaphragm vibration, thereby ensuring reliable vibration freedom.
Solution Approach 2:
The lead wire is positioned and fixed within the diaphragm layer through injection molding before the diaphragm assembly is completed. This preliminary positioning ensures that the lead wire is properly secured and cannot interfere with voice coil movement during subsequent operation.
3Object-affected harmful factors
If the lead wire vibrates during voice coil operation, then electrical connection is maintained, but the lead wire collides with the shell and degrades sound quality
Solution Approach 1:
The lead wire is nested within the injection molded diaphragm layer structure, which completely encloses and stabilizes it. This embedding prevents the lead wire from vibrating or moving during voice coil operation, eliminating the collision with the speaker shell and thereby preserving sound quality.
Solution Approach 2:
The injection molded diaphragm layer serves as an intermediary structure that isolates the lead wire from the speaker shell environment. This intermediary encapsulation prevents the lead wire from vibrating and colliding with the shell, eliminating noise and degradation of sound quality.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively eliminates noise from lead wire collisions with the speaker shell, enhancing sound quality and vibration performance by ensuring the lead wire is fully embedded within the diaphragm structure.
Implementation Method 1
a part of the lead wire is injection-molded in the lead wire enclosure portion
Implementation Method 2
the lead wire enclosure portion is injection-molded in the diaphragm layer
Data Source
AI summary
A speaker diaphragm and a molding method therefor are provided. The speaker diaphragm comprises: a lead wire; a lead wire enclosure portion, wherein the lead wire enclosure portion has a membrane part and support protrusions, the support protrusions are distributed on a surface of the membrane part, the thickness of the membrane part is larger than or equal to the diameter of the lead wire, the thickness of the overall lead wire enclosure portion is larger than the diameter of the lead wire, and a part of the lead wire is injection-molded in the lead wire enclosure portion; and a diaphragm layer, wherein the diaphragm layer is configured to form an overall structure of the speaker diaphragm, the thickness of the diaphragm layer is larger than or equal to the thickness of the overall lead wire enclosure portion, and the lead wire enclosure portion is injection-molded in the diaphragm layer.