Dichroic Mirror Horizontal Coupling Compact Electro-Optics
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Solution Overview
Problem
Integrated optical devices with optical gratings on silicon substrates face challenges in compact design due to perpendicular signal paths, leading to large side profiles and issues with optical fiber bending radius, and existing methods require active alignment and are prone to environmental contamination.
Innovation Solution
An electro-optic device with a photonic chip, integrated circuit, and an optical element like an optical fiber or lens, featuring a dichroic mirror aligned with the optical path, encapsulated in a photopolymer material that cures in response to specific electromagnetic radiation, allowing for horizontal fiber coupling and passive alignment, reducing module height and enhancing mechanical robustness.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If optical gratings are formed on silicon substrates with perpendicular signal paths, then integrated optical devices can be implemented with compact dimensions at low cost, but the side profile of the coupling device becomes large and optical fiber bending radius is constrained
Solution Approach 1:
The patent transitions from a perpendicular optical path (vertical dimension) to a horizontal optical path by introducing a dichroic mirror that reflects light at 90 degrees. This dimensional change allows the optical fiber to couple horizontally, reducing the side profile height of the coupling device while maintaining the benefits of integrated optical processing on silicon substrates
2Manufacturing precision
If active alignment methods are used for optical fiber coupling, then precise optical alignment can be achieved, but the device becomes more complex and is prone to environmental contamination
Solution Approach 1:
The patent employs passive alignment where the optical fiber position is pre-determined by fixed geometric relationships with the silicon substrate and dichroic mirror, eliminating the need for active alignment mechanisms. This preliminary positioning approach simplifies the device structure while maintaining optical precision and reduces exposure to environmental contaminants by sealing the compact housing
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables a compact, mechanically robust electro-optic device with reduced side profile and no active alignment requirements, improving optical path stability and reducing exposure to environmental contaminants, while maintaining efficient optical signal transmission.
Implementation Method 1
The photonic chip may operate at a second wavelength of electromagnetic radiation, and the dichroic mirror may reflect the second wavelength of electromagnetic radiation and transmit the first wavelength of electromagnetic radiation
Implementation Method 2
The polymer material may comprise a photopolymer configured to cure responsive to a first wavelength of electromagnetic radiation
Implementation Method 3
optical gratings are formed in the silicon substrate or chip for input-output of the photonic signal
Data Source
AI summary
An electro-optic device may include a photonic chip having an optical grating at a surface, and an IC coupled to the photonic chip. The electro-optic device may include an optical element defining an optical path above the optical grating, and a dichroic mirror above the optical grating and aligned with the optical path.