Dicing Die Bonding Sheet Adhesive Layer Separation
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Solution Overview
Problem
In the wafer backside laminating method for semiconductor manufacturing, the interaction between the film adhesive and pressure-sensitive adhesive layers in a dicing/die bonding sheet leads to unsatisfactory separation of semiconductor elements during the dicing process, resulting in poor adhesiveness and increased manufacturing costs.
Innovation Solution
A dicing/die bonding sheet with a pressure-sensitive adhesive layer containing radiation-curable compounds and a separate adhesive layer comprising an epoxy resin, phenolic resin, and a filler, designed to maintain adhesiveness while allowing easy separation of semiconductor elements, is developed. The pressure-sensitive adhesive layer includes compounds with intramolecular carbon-carbon double bonds and additives like polyisocyanates, melamine-formaldehyde resins, or epoxy resins, while the adhesive layer incorporates an epoxy group-containing acrylic copolymer and a curing accelerator.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If an integrated dicing/die bonding sheet comprising a film adhesive provided on a dicing tape is used, then the manufacturing process is simplified and costs are reduced, but the adhesive layer and pressure-sensitive adhesive layer interact over a long period causing unsatisfactory separation during dicing
Solution Approach 1:
The patent divides the adhesive system into two distinct layers: a pressure-sensitive adhesive layer (with iodine value 0.5-20) and a separate adhesive layer (with iodine value >20). This segmentation allows each layer to perform its specific function independently - the pressure-sensitive adhesive provides initial bonding while the separate adhesive layer ensures clean separation during dicing, preventing the interaction problems that occur in integrated sheets.
2Stability of the object's composition
If the adhesive layer and pressure-sensitive adhesive layer are in contact for a long period, then the integrated sheet structure is maintained, but the two layers interact causing poor separation during element pickup
Solution Approach 1:
The patent applies local quality by giving different chemical properties to different layers. The pressure-sensitive adhesive layer has specific iodine value (0.5-20) for stable bonding, while the adhesive layer has higher iodine value (>20) for easy separation. This localized differentiation allows the sheet to maintain structural stability during storage while enabling easy separation during the dicing operation.
3Device complexity
If a single layer film adhesive is used to bond semiconductor elements, then the process is simplified, but separate apparatus for dicing and bonding cannot be avoided increasing costs
Solution Approach 1:
The patent creates a multi-functional integrated sheet that serves both as a dicing tape and a die bonding carrier. The pressure-sensitive adhesive layer enables the sheet to function as a dicing tape during cutting, while the adhesive layer allows it to function as a die bonding carrier afterward. This universality eliminates the need for separate dicing and bonding apparatus, reducing equipment costs and simplifying the manufacturing process.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables effective separation of semiconductor elements from the pressure-sensitive adhesive layer during dicing and ensures satisfactory adhesiveness for die bonding, reducing manufacturing costs and improving the efficiency of the semiconductor device production process.
Implementation Method 1
the pressure-sensitive adhesive layer comprises a compound (A), containing intramolecular, radiation curable carbon-carbon double bonds
Data Source
AI summary
The present invention provides a dicing/die bonding sheet which can be used as a dicing tape during dicing, enables ready separation of the semiconductor element and the adhesive layer from the pressure-sensitive adhesive layer during pickup, and in which the adhesive layer has satisfactory adhesiveness as a die bonding material. A dicing/die bonding sheet in which the pressure-sensitive adhesive layer comprises a compound (A), containing intramolecular, radiation curable carbon-carbon double bonds with an iodine value of 0.5 to 20, and at least one compound (B) selected from a group consisting of polyisocyanates, melamine-formaldehyde resins, and epoxy resins, and the adhesive layer comprises an epoxy resin (a), a phenolic resin (b) with a hydroxyl equivalent of at least 150 g/eq., an epoxy group-containing acrylic copolymer (c), comprising from 0.5 to 6% by weight of glycidyl acrylate or glycidyl methacrylate, and with a weight average molecular weight of at least 100,000, a filler (d), and a curing accelerator (e).