Dicing Die Attach Film Composition for Stable Pickup and Heat Dissipation
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Solution Overview
Problem
The challenge in semiconductor processing is that thermally conductive die attach films with high thermal conductivity tend to decrease the peeling property between the die attach film and the dicing film, leading to pickup failures during the dicing and pickup steps, especially when the pickup collet stores heat, and can result in void generation during thermocompression bonding to a wiring board.
Innovation Solution
A dicing die attach film is developed by laminating a thermally conductive die attach film with a temporary-adhesive layer, where the adhesive layer contains an epoxy resin, an epoxy resin curing agent, a phenoxy resin with an elastic modulus of 500 MPa or more, and an inorganic filler, ensuring a peeling strength of 0.40 N/25 mm or less between the layers and thermal conductivity of 1.0 W/m·K or more after thermal curing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a thermally conductive die attach film with high thermal conductivity is used, then heat dissipation efficiency is improved, but peeling property between the die attach film and dicing film deteriorates, leading to pickup failures
Solution Approach 1:
The patent applies parameter changes by carefully controlling the elastic modulus of the phenoxy resin (500-2000 MPa) and its content ratio (10-60% of total resin), as well as the thermal conductivity (1.0-3.0 W/m·K). These parameter optimizations enable the die attach film to achieve both high thermal conductivity for heat dissipation and appropriate peeling properties to prevent pickup failures during dicing.
Solution Approach 2:
The patent uses composite materials by combining epoxy resin with phenoxy resin (at a ratio of 40:60 to 90:10), and incorporating inorganic fillers. This composite formulation allows the material to simultaneously achieve high thermal conductivity through the inorganic fillers and controlled mechanical properties through the resin combination, resolving the contradiction between heat dissipation and peeling performance.
2Use of energy by moving object
If the pickup collet stores heat during repeated pickup operations, then heat transmission to the dicing film increases, but this causes decreased peeling property and pickup failures
Solution Approach 1:
The patent controls the glass transition temperature of the phenoxy resin (20-100°C) and its elastic modulus at service temperature to maintain appropriate peeling properties even when heat is transmitted from the pickup collet. This ensures the die attach film can withstand repeated thermal cycling during pickup operations without failing to peel properly.
3Strength
If thermocompression bonding is performed with high pressure and temperature, then die attach property is improved, but void generation increases due to poor peeling property
Solution Approach 1:
The patent optimizes the melt viscosity of the die attach film (100-10000 Pa·s at bonding temperature) and controls the thermal conductivity (1.0-3.0 W/m·K) to enable effective thermocompression bonding. These parameter controls allow the film to flow properly during bonding to eliminate voids while maintaining sufficient peeling strength to prevent pickup failures.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively prevents pickup failures and void generation, enhancing the die attach property and heat dissipation efficiency while maintaining a high level of thermal conductivity, thus improving the semiconductor package's reliability and performance.
Implementation Method 1
the adhesive layer is a film-like adhesive layer containing an epoxy resin (A), an epoxy resin curing agent (B), a phenoxy resin (C), and an inorganic filler (D)... a thermal conductivity of the adhesive layer after thermal curing is 1.0 W/m·K or more
Implementation Method 2
an adhesive layer and a temporary-adhesive layer are laminated... an epoxy resin (A), an epoxy resin curing agent (B)... after thermal curing
Data Source
AI summary
A dicing die attach film, including an adhesive layer and a temporary-adhesive layer, the adhesive layer and the temporary-adhesive layer being laminated,whereinthe adhesive layer is a film-like adhesive layer containing an epoxy resin (A), an epoxy resin curing agent (B), a phenoxy resin (C), and an inorganic filler (D);an elastic modulus of the phenoxy resin (C) at 25° C. is 500 MPa or more; in the adhesive layer, a proportion of the phenoxy resin (C) in total content of the epoxy resin (A) and the phenoxy resin (C) is 10 to 60% by mass;a peeling strength between the adhesive layer and the temporary-adhesive layer at a range of 25 to 80° C. is 0.40 N/25 mm or less; anda thermal conductivity of the adhesive layer after thermal curing is 1.0 W/m·K or more.