Dicing Film Adhesive Composition for Semiconductor Pick-Up
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Solution Overview
Problem
The dicing process for semiconductor wafers faces issues with fixation between films during chip pick-up, leading to low success rates and chip cracks due to excessive peel strength, which affects the reliability of the semiconductor manufacturing process.
Innovation Solution
A composition for forming an adhesive layer in a dicing film, comprising a silicon compound oil with reactive functional groups, an adhesive binder, and a photoinitiator, is used to create a dicing die bonding film that prevents film fixation and maintains high die shear strength, thereby improving pick-up success rates and preventing delamination.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If a dicing film with strong adhesive properties is used to fix the wafer, then wafer fixation is improved, but film fixation occurs during pick-up process and chip cracks are generated
Solution Approach 1:
The patent applies parameter changes by carefully controlling the weight ratio of silicon compound oil to adhesive binder within 0.01% to 4.5%. This optimization adjusts the adhesive properties of the dicing film to achieve appropriate peel strength that prevents both wafer detachment and film fixation during pick-up, thereby resolving the contradiction between strong fixation and high pick-up success rate
Solution Approach 2:
The patent uses composite materials by combining silicon compound oil with reactive functional groups, adhesive binders, and photoinitiators in specific proportions. This composite adhesive composition enables the dicing film to exhibit controlled adhesive characteristics that prevent excessive peel strength and film fixation while maintaining reliable wafer fixation, thus improving pick-up success rate
2Strength
If peel strength between films is excessive to ensure wafer fixation, then wafer fixation is improved, but delamination is prevented but chip cracks are generated
Solution Approach 1:
The patent applies parameter changes by optimizing the concentration of silicon compound oil (0.01% to 4.5% by weight relative to adhesive binder) to precisely control peel strength. This parameter optimization ensures that the adhesive layer provides sufficient fixation strength while avoiding excessive peel strength that would cause chip cracks during the pick-up process
3Reliability
If adhesive strength is increased to prevent delamination, then bonding reliability is improved, but film fixation occurs during pick-up
Solution Approach 1:
The patent applies parameter changes by controlling the weight ratio of silicon compound oil to adhesive binder within 0.01% to 4.5%, which optimizes the adhesive strength to prevent delamination while avoiding film fixation during pick-up. This precise parameter control resolves the contradiction between bonding reliability and film fixation prevention
Solution Approach 2:
The silicon compound oil acts as an intermediary substance that modifies the adhesive properties of the adhesive binder. By incorporating this intermediary component in controlled amounts, the adhesive layer achieves balanced properties that prevent both delamination and film fixation, resolving the contradiction between bonding reliability and pick-up process smoothness
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The composition effectively reduces peel strength and enhances die shear strength, improving the reliability of the semiconductor manufacturing process by facilitating delamination and ensuring successful chip pick-up and bonding.
Implementation Method 1
a composition for forming an adhesive layer of a dicing film including a silicon compound oil including: at least one reactive functional group; an adhesive binder; and a photoinitiator
Data Source
AI summary
There are provided a composition for forming an adhesive layer of a dicing film including: a silicon compound oil including at least one reactive functional group; an adhesive binder; and a photoinitiator, wherein a weight ratio of the silicon compound oil including at least one reactive functional group to the adhesive binder is 0.01% to 4.5%, a dicing film including an adhesive layer including the composition, a dicing die bonding film including the dicing film, and a method for dicing a semiconductor wafer using the dicing die bonding film.