Dicing Film Cohesive Layer Modulus and Cross-Linking Control
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Solution Overview
Problem
The dicing process for thin semiconductor chips faces challenges in maintaining pick-up ability and preventing damage due to excessive power application during separation of adhesive and cohesive layers, leading to deteriorated performance and potential chip damage.
Innovation Solution
A dicing film with a cohesive layer having a specific storage modulus of 3.0*105 to 4.0*106 Pa and a degree of cross-linking of 80% to 99%, combined with a substrate film and an adhesive layer, is used to enhance pick-up ability and prevent chip damage, featuring a (meth)acrylate-based resin, photoinitiator, and cross-linking agents, along with a thermoplastic resin and curing agents in the adhesive layer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If excessive power is applied to separate adhesive and cohesive layers during dicing, then separation efficiency is improved, but thin semiconductor chips are damaged
Solution Approach 1:
The patent changes the physical parameters of the cohesive layer by controlling its storage modulus to be within 10^5 to 10^6 Pa and its degree of cross-linking to be 80-99%. This creates a material with optimized mechanical properties that allows easy separation while protecting thin chips from damage during the dicing process.
Solution Approach 2:
The cohesive layer is formulated as a composite material containing (meth)acrylate-based resin, photoinitiator, and cross-linking agent. This composite structure provides both the required low storage modulus for easy separation and high degree of cross-linking for chip protection, resolving the contradiction between separation efficiency and chip integrity.
2Strength
If the cohesive layer has high storage modulus for structural stability, then mechanical strength is improved, but pick-up ability deteriorates
Solution Approach 1:
The patent optimizes the storage modulus parameter to a specific range (10^5 to 10^6 Pa) that balances mechanical strength and pick-up ability. Additionally, controlling the degree of cross-linking (80-99%) further fine-tunes the material properties to achieve both structural stability and easy separation for improved pick-up ability.
3Strength
If the degree of cross-linking is increased to improve cohesive strength, then separation difficulty increases, but chip protection improves
Solution Approach 1:
The patent identifies an optimal range for the degree of cross-linking (80-99%) that provides sufficient cohesive strength for chip protection while maintaining ease of separation. This parameter optimization resolves the contradiction between cohesive strength and separation ease by finding the sweet spot in the cross-linking degree.
Solution Approach 2:
The use of photopolymerization allows the cohesive layer to be formed with precise control over cross-linking degree. By copying the desired material properties through controlled photoreaction, the patent achieves both high cohesive strength and easy separation characteristics simultaneously.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution improves pick-up ability and prevents damage to thin semiconductor chips by optimizing the cohesive layer's properties, ensuring efficient separation and reducing the risk of chip flying or delamination, thereby enhancing the dicing process's efficiency and reliability.
Implementation Method 1
the cohesive layer has a degree of cross-linking of 80% to 99%
Data Source
AI summary
The present invention relates to a dicing film including: a substrate film; and a cohesive layer, wherein a storage modulus of the cohesive layer at 30° C. is 3*105 to 4*106 Pa, and the cohesive layer has a degree of cross-linking of 80% to 99%, a dicing die-bonding film including the dicing film, and a dicing method of a semiconductor wafer using the dicing die-bonding film.