Dicing Sheet Stripping Stage to Prevent Flying Semiconductor Chips
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Solution Overview
Problem
During semiconductor manufacturing, small pieces of unnecessary chips produced during the dicing process often fly off and damage the intended semiconductor chips due to inadequate adhesion stripping techniques.
Innovation Solution
A semiconductor manufacturing apparatus featuring a stage with protrusions, including tapered first protrusions on the center portion and non-tapered second protrusions on the perimeter portion, facilitates the stripping of semiconductor chips from a dicing sheet while preventing unnecessary chips from flying off by controlling gas evacuation between the stage and the dicing sheet.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If gases are evacuated to strip the dicing sheet from semiconductor chips, then the adhesion between the dicing sheet and semiconductor chips is reduced, but unnecessary chips fly off and damage the semiconductor chips
Solution Approach 1:
The stage surface is segmented into different regions with different protrusion types: first protrusions with tapered portions in the center region for facilitating chip stripping, and second protrusions without tapered portions in the perimeter region for preventing unnecessary chips from flying off. This segmentation allows different functional zones to address different aspects of the contradiction simultaneously.
Solution Approach 2:
Different regions of the stage are given different local qualities through the use of protrusions with different geometries. The center region has tapered protrusions that promote dicing sheet release, while the perimeter region has non-tapered protrusions that provide mechanical support to contain unnecessary chips. Each local region is optimized for its specific function to resolve the contradiction between stripping efficiency and chip containment.
2Device complexity
If uniform protrusions are used across the entire stage, then the structure is simple, but either chip stripping is insufficient or unnecessary chips fly off
Solution Approach 1:
The protrusion structure is segmented into two distinct types based on location: first protrusions with tapered portions for the center region and second protrusions without tapered portions for the perimeter region. This segmentation increases structural complexity but is necessary to achieve reliable chip stripping in the center while containing unnecessary chips at the perimeter.
Solution Approach 2:
The protrusion design implements local quality by varying the geometry according to position on the stage. The tapered shape in the center provides the necessary adhesion release, while the non-tapered shape at the perimeter provides mechanical containment. This localized differentiation resolves the contradiction between structural simplicity and functional reliability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The apparatus effectively strips semiconductor chips from the dicing sheet without causing unnecessary chips to fly off, ensuring the integrity and quality of the semiconductor chips by optimizing the design of protrusions and gas evacuation.
Implementation Method 1
a gas evacuation device evacuating gases from a space between the stage and the dicing sheet
Data Source
AI summary
Provided is a semiconductor manufacturing apparatus preventing unnecessary chips from flying off when the semiconductor chips are stripped. A semiconductor manufacturing apparatus stripping the semiconductor chips obtained by dividing an approximately circular wafer into small pieces through dicing, from a dicing sheet on one surface of which the wafer including the semiconductor chips is attached, the apparatus including: a stage including protrusions; a dicing sheet holder; and a gas evacuation device evacuating gases from a space between the stage and the dicing sheet, wherein the protrusions include first protrusions each including a tapered portion that is tapered in a cross-sectional view and an end disposed on a center portion that is an approximately circular region in a center of the stage, and at least one second protrusion without any tapered portion which includes an end disposed on a perimeter portion surrounding the center portion in a plan view.