Semiconductor Dicing Tape for Thick Adhesive Layer Separation
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Solution Overview
Problem
The existing semiconductor-processing tapes face challenges in dividing adhesive layers with thick, low storage elastic modulus, leading to inadequate space control between semiconductor chips and high pick-up failure rates, especially when dealing with wafers having bumps or complex surfaces.
Innovation Solution
A semiconductor-processing tape with a base material film characterized by specific stress values, tensile strength, and thickness, along with an adhesive layer of controlled thickness and storage elastic modulus, allows for effective division and heat shrinkage to maintain uniform spacing between chips, even with thick adhesive layers.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If the adhesive layer is made thick with low storage elastic modulus to improve adhesion, then the adhesion performance is improved, but the division of adhesive layer becomes inadequate and space control between chips deteriorates
Solution Approach 1:
The patent applies parameter changes by precisely controlling the storage elastic modulus within 100-1000 kPa and thickness within 50-200 μm range. This optimization allows the adhesive layer to maintain both thick structure for adhesion and appropriate mechanical properties for division, resolving the contradiction between adhesion performance and space control precision
Solution Approach 2:
The patent utilizes the dynamic mechanical properties of the adhesive layer by controlling its storage elastic modulus to exhibit viscoelastic behavior. This allows the adhesive layer to be dynamic during expansion (allowing division) and stable during chip mounting (maintaining spacing), thus resolving the contradiction between adhesion and space control
2Strength
If the adhesive layer is made thick with low storage elastic modulus to improve adhesion, then the adhesion performance is improved, but pick-up failure rate increases
Solution Approach 1:
The patent optimizes the storage elastic modulus parameter to 100-1000 kPa and thickness to 50-200 μm, creating a balanced adhesive layer that provides sufficient adhesion while maintaining appropriate mechanical strength for pick-up operations, thereby resolving the contradiction between adhesion performance and pick-up reliability
Solution Approach 2:
The patent establishes a feedback mechanism through controlled expansion where the adhesive layer's mechanical response provides information about its properties. The controlled storage elastic modulus ensures that during expansion and pick-up, the adhesive layer exhibits predictable behavior that prevents pick-up failure while maintaining adhesion
3Length of moving object
If the base material film is made thin to reduce overall tape thickness, then the tape flexibility is improved, but the stress transmission capability during expansion deteriorates
Solution Approach 1:
The patent employs composite material design by combining a thin base material film (70-150 μm) with a specifically engineered adhesive layer (50-200 μm, storage elastic modulus 100-1000 kPa). This composite structure achieves both flexibility from the thin base film and stress transmission capability from the optimized adhesive layer, resolving the contradiction between tape thickness and stress transmission
4Manufacturing precision
If the storage elastic modulus of adhesive layer is increased to improve space maintenance, then the space control between chips is improved, but the adhesion performance deteriorates
Solution Approach 1:
The patent applies parameter changes by optimizing the storage elastic modulus to the specific range of 100-1000 kPa. This precise parameter control allows the adhesive layer to maintain low enough modulus for good adhesion while being high enough to provide adequate space control, resolving the contradiction between adhesion performance and space maintenance
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The tape enables reliable division of adhesive layers and reduces pick-up failure by ensuring uniform spacing and adequate stress transmission during expansion, suitable for both standard and bump-structured wafers.
Implementation Method 1
the adhesive layer has a storage elastic modulus of 100 kPa or more and 1 GPa or less at 25° C., thereby enabling a force caused by expansion to be transmitted to the adhesive layer
Implementation Method 2
a process of maintaining a space between the semiconductor chips in the semiconductor-processing tape after the expansion process, by subjecting a portion of said semiconductor-processing tape which does not overlap with the semiconductor chips, to heat shrinkage
Data Source
AI summary
A semiconductor-processing tape, for use in dividing an adhesive layer along semiconductor chips by expansion, having a base material film, a removable adhesive layer, and an adhesive layer, in this order, wherein the base material film has the stress values in MD and TD at the time of 5%-elongation of 5 MPa or, more, the tensile strength values in MD and TD at the time of 5%-elongation of 10 to 30 N/25 mm, and the thickness of from 70 to 150 μm, and wherein the adhesive layer has a thickness of 40 μm or more and the storage elastic modulus at 25° C. of 2000 MPa or less.