Dicing Tape Incision Pattern for Clean Ring Frame Removal
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Solution Overview
Problem
The high adhesive strength of dicing tapes during the wafer dicing process often results in the tapes being torn and left on the ring frame, causing defects in subsequent processes, leading to increased costs.
Innovation Solution
An adhesive tape sheet with an incision pattern portion featuring first and second convex arch-shaped patterns along concentric circles, where the first patterns enhance adhesive force and the second patterns prevent cracking, allowing complete removal of the tape without residue.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If the adhesive strength of the dicing tape is increased to prevent separation from the ring frame during wafer dicing, then the tape maintains strong attachment during the dicing process, but the tape becomes difficult to remove completely and may be torn, leaving residues on the ring frame that cause defects in subsequent processes
Solution Approach 1:
The attachment region of the dicing tape is divided into multiple incision pattern portions arranged in concentric circles. These incision patterns create segmented weak points that allow the tape to be cleanly separated from the ring frame after use, preventing tearing and residues while maintaining strong adhesive strength during the dicing process.
2Strength
If the adhesive strength is increased to ensure the tape remains attached during expansion and dicing, then the tape performs well during processing, but the tape cannot be cleanly removed and causes defects
Solution Approach 1:
Incision patterns are pre-formed in the attachment region of the dicing tape before use. These pre-formed incisions create predetermined separation paths that enable clean removal of the tape after the dicing process, preventing the generation of harmful residues and defects on the ring frame.
3Stability of the object's composition
If the tape is designed with high adhesive strength for secure attachment, then the tape prevents separation during wafer expansion, but the tape tears upon removal and leaves residues on the ring frame
Solution Approach 1:
The dicing tape has non-uniform structure: the central region maintains high adhesive strength for stable attachment during dicing, while the attachment region contains incision patterns that create localized weak points for easy separation. This local quality differentiation allows the tape to be both stable during use and easy to remove without tearing.
Data Source
AI summary
An adhesive tape sheet includes a dicing tape having an attachment region extending along an outer circumference thereof so as to be attached to a ring frame used when dicing a wafer, an adhesive film on the dicing tape radially inside of an inner boundary of the attachment region and to which the wafer is bonded, and an incision pattern portion within the attachment region and including first incision patterns that are spaced apart from each other along a first concentric circle having a first radius and second incision patterns that are spaced apart from each other along a second concentric circle having a second radius greater than the first radius. Each of the first incision patterns has a convex arch shape toward a center of the dicing tape, and each of the second incision patterns has a convex arch shape toward an outside of the dicing tape.