Dicing Tape Mounting Apparatus with Pre-Cut and Tension Control
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Solution Overview
Problem
Conventional methods for fixing semiconductor wafers to ring frames using dicing tapes result in damage to the ring frames due to cutting processes, material wastage, and compromised plane accuracy due to winding pressure and adhesive deformation.
Innovation Solution
A mounting apparatus and method that forms dicing tapes in a predetermined shape by cutting a strip material as it is fed out, eliminating the need for post-sticking cutting and ensuring precise sticking by using a tension control system and pre-cut means to maintain constant tension and accurate positioning.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If a dicing tape continuing in a strip shape is stuck and then cut off with a cutter, then the dicing tape can be applied to the ring frame, but the ring frame is considerably damaged by the cutter blade and material is wasted
Solution Approach 1:
The dicing tape is pre-cut into the desired shape before being applied to the ring frame. This preliminary cutting action eliminates the need for post-application cutting with a cutter, thereby preventing damage to the ring frame while maintaining ease of manufacture.
Solution Approach 2:
Instead of applying a continuous strip of dicing tape and then cutting it to shape (the conventional approach), the invention inverts the sequence by first cutting the dicing tape to the required shape and then applying it. This reversal eliminates the harmful cutting action on the ring frame.
2Ease of manufacture
If dicing tapes are previously cut in a shape of the ring frame and wound in a roll, then the cutting process is simplified, but the tape base is peeled off during feeding and plane accuracy deteriorates due to winding pressure
Solution Approach 1:
The dicing tape is pre-cut into the desired shape before winding, but the cutting is done in a controlled manner that prevents adhesive deformation. The pre-cut tapes are then carefully wound while maintaining their shape, eliminating peeling issues and preserving plane accuracy.
Solution Approach 2:
The invention changes the parameters of the winding process, such as winding tension and speed, to prevent the tape base from peeling off and to avoid elastic deformation of the adhesive. This ensures that plane accuracy is maintained while still allowing for efficient roll-based feeding.
3Ease of operation
If a continuous dicing tape is used and cut off after sticking, then the application process is simple, but considerable material is wasted and economical burden increases
Solution Approach 1:
The dicing tape is pre-cut into the exact shape and size needed before application. This preliminary cutting eliminates excess material that would otherwise be wasted during post-application cutting, thereby reducing material loss while maintaining ease of operation.
Solution Approach 2:
The invention changes the cutting parameter from post-application (where excess material is generated) to pre-application (where only the necessary amount is cut). This parameter change significantly reduces material waste while keeping the application process simple.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Prevents ring frame damage, reduces material wastage, and maintains high plane accuracy by forming dicing tapes in real-time during the feeding process, ensuring precise sticking and preventing press-trace or press-damage issues.
Implementation Method 1
a dancer roller 21 which is movable vertically so as to allow the strip material A to be fed out toward the sticking means 34 while giving tension due to its own weight
Implementation Method 2
a film for forming dicing tapes is stuck to one surface of a base sheet
Data Source
AI summary
There is provided a mounting apparatus capable of forming dicing tapes in the process of feeding-out a strip material, and sticking the dicing tape to a ring frame to fix a semiconductor wafer.The mounting apparatus 10 sticks the dicing tape to the ring frame RF to fix the semiconductor wafer to the ring frame in a state that the ring frame RF and the semiconductor wafer W are disposed on a table 11. The mounting apparatus 10 includes a pre-cut means 13 for forming a cut L in a state of half cut in a film FL of a strip material A to form a dicing tape T in the process of feeding out the strip material A and a sticking means 34 for peeling off the dicing tape from a base sheet S to stick the dicing tape to the ring frame RF.