Dicing Tape Probe Inspection for Divided Semiconductor Chips
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional electrical characteristic inspections of semiconductor devices face challenges due to damage in the dicing process, requiring separate measurements in wafer and chip states, which increases costs and transportation defects.
Innovation Solution
A semiconductor manufacturing device with a probe pin inserted into a dicing tape to electrically connect with semiconductor chips, allowing for electrical characteristic inspections while the chips are attached to the tape, using a dicing tape without holes to prevent weakening of the wafer's fixing force.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If a dicing tape with holes is used to measure divided chips, then electrical characteristic inspection can be performed on divided chips, but the fixing force of the wafer is weakened in dicing
Solution Approach 1:
The patent extracts the inspection function from the dicing tape structure itself by using a separate probe pin that penetrates the tape to contact the chip, rather than relying on holes in the tape. This allows the tape to remain intact and maintain its fixing force while still enabling electrical characteristic inspection through the probe pin contact.
2Productivity
If measurement is performed in wafer state, then inspection can be done, but damage in dicing process cannot be considered
Solution Approach 1:
The patent performs electrical characteristic inspection after the dicing process by penetrating the dicing tape with a probe pin to contact the divided chip. This preliminary action allows detection of chips that may have been damaged during dicing, ensuring that only functional chips proceed to subsequent steps, thereby improving reliability without sacrificing inspection efficiency.
3Measurement precision
If divided chip is transferred for measurement in chip state, then accurate inspection can be performed, but transportation defects and facility cost increase
Solution Approach 1:
The patent merges the inspection process with the existing dicing tape setup by penetrating the tape with a probe pin to contact the chip in place. This eliminates the need for separate transportation facilities and handling processes, reducing facility investment and transportation defects while maintaining measurement precision through direct probe pin contact with the chip electrodes.
Data Source
AI summary
Provided are a semiconductor manufacturing device capable of performing an electrical characteristic inspection while a divided chip is attached to a dicing tape and a method of manufacturing a semiconductor device. A semiconductor device include: a stage on which a dicing tape to which a plurality of semiconductor chips are attached is disposed; a probe pin provided to the stage and inserted into an inner part of the dicing tape to be electrically connected to the semiconductor chips; and a tester performing an electrical characteristic inspection on the semiconductor chips via the probe pin.