Acoustic Waveguide Diffraction Grating for Low-Loss Die Imaging
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Solution Overview
Problem
High-frequency acoustic wave technologies face challenges in semiconductor packages due to packaging materials, bondwires, and active circuitry obstructing wave propagation, leading to reflections, dispersion, and losses, which limit the imaging of fine features in industrial and medical applications.
Innovation Solution
Incorporating an acoustic waveguide with a diffraction grating within the semiconductor die, oriented parallel to its surfaces, to direct high-frequency acoustic waves vertically through the die and into the target medium, minimizing attenuation and enabling high-resolution imaging.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If high-frequency acoustic waves are used for imaging, then imaging resolution is improved, but wave propagation is obstructed by packaging materials, bondwires, and active circuitry causing reflections, dispersion, and losses
Solution Approach 1:
The patent segments the acoustic wave propagation path by introducing a waveguide structure that divides the package into distinct regions: a waveguide cavity that guides acoustic waves away from obstructive packaging materials, bondwires, and circuitry, and a target medium region where imaging occurs. This segmentation allows high-frequency waves to propagate through the waveguide with minimal interference, maintaining both high resolution and reliable wave transmission.
Solution Approach 2:
The waveguide acts as an intermediary structure between the acoustic source and the target medium. It provides a dedicated propagation path that mediates the interaction between high-frequency acoustic waves and the packaging environment, preventing direct contact with obstructive elements while still enabling effective imaging of the target medium.
2Adaptability or versatility
If packaging materials and circuitry are included for functional packaging, then device functionality is improved, but acoustic wave propagation is obstructed leading to reflections and losses
Solution Approach 1:
The package structure is segmented into a waveguide cavity region and a target medium region. The waveguide cavity is specifically designed to exclude packaging materials, bondwires, and active circuitry from the acoustic propagation path, while these elements can still be present in other parts of the package for functional purposes. This segmentation reduces acoustic energy losses while maintaining full device functionality.
Solution Approach 2:
The waveguide cavity provides a localized region of optimized acoustic properties, free from obstructive elements, while the rest of the package can contain necessary functional components. This local quality optimization allows acoustic waves to propagate with minimal losses in the waveguide region while the package as a whole maintains its functional versatility.
3Device complexity
If acoustic waves propagate through packaging materials and circuitry, then device integration is simplified, but wave reflections and dispersion increase reducing imaging quality
Solution Approach 1:
The patent introduces a waveguide cavity that segments the acoustic propagation path from the packaging materials and circuitry. This segmentation creates a dedicated channel for acoustic wave travel that is isolated from sources of reflections and dispersion, thereby maintaining high imaging quality while still allowing integrated packaging for device functionality.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration allows high-frequency acoustic waves to propagate effectively through the semiconductor die and into the target medium, enhancing imaging resolution by reducing wave losses and reflections, thus overcoming the limitations of low-frequency acoustic wave technologies.
Implementation Method 1
The transducer portion is configured to convert signals between electrical signals and acoustic waves
Implementation Method 2
the diffraction grating portion is configured to direct the acoustic waves toward and receive the acoustic waves from the second surface
Data Source
AI summary
In some examples, a package comprises a semiconductor die having a first surface and a second surface opposing the first surface, the semiconductor die including circuitry formed in the first surface. The package includes an acoustic waveguide in the semiconductor die, the acoustic waveguide including an array of capacitors. The array of capacitors includes a transducer portion and a diffraction grating portion. The transducer portion is configured to convert signals between electrical signals and acoustic waves, and the diffraction grating portion is configured to direct the acoustic waves toward and receive the acoustic waves from the second surface.