Die Bonding Adhesive Particle Distribution Against Wet-Spreading
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Solution Overview
Problem
Photosemiconductor devices face contamination issues due to wet-spreading of die bonding adhesive materials, which interfere with wire bonding and die bonding, and existing solutions like forming grooves on lead electrodes do not fully address the problem.
Innovation Solution
A semiconductor device with a base body and a semiconductor element bonded using an adhesive member containing surface-treated particles or particles with a dispersing agent, where at least a part of the adhesive member's marginal portion has uneven particle distribution, suppressing wet-spreading through capillary forces and convection currents.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If die bonding adhesive material is applied to bond semiconductor element on base body, then bonding strength is improved, but wet-spreading occurs contaminating the upper surface of substrate
Solution Approach 1:
The adhesive member incorporates particles with non-uniform distribution where the concentration of particles varies in different regions. Specifically, the particle concentration is higher near the marginal portion and lower toward the center, creating local variations in viscosity and surface tension that suppress wet-spreading at the edges while maintaining bonding strength in the bonding region
Solution Approach 2:
The adhesive member is formulated as a composite material containing a resin base and dispersed particles (such as metal particles, oxide particles, or phosphor particles). This composite structure modifies the rheological properties of the adhesive to control wet-spreading behavior while maintaining effective bonding characteristics
2Object-affected harmful factors
If groove is formed on surface of lead electrode to prevent wet-spreading, then contamination is reduced, but device complexity and manufacturing difficulty increase
Solution Approach 1:
Instead of modifying the geometric structure of the base body or lead electrode, the invention changes the material parameters of the adhesive member itself by incorporating particles with specific concentration distributions. This approach controls wet-spreading through material composition rather than structural design, avoiding increased device complexity
Solution Approach 2:
The solution extracts the wet-spreading control function from the base body structure and transfers it to the adhesive member composition. By formulating the adhesive with appropriate particle distributions, the adhesive itself becomes the active element that prevents wet-spreading, eliminating the need for additional structural features like grooves
3Ease of manufacture
If particles are uniformly distributed in adhesive member, then manufacturing simplicity is maintained, but wet-spreading cannot be suppressed
Solution Approach 1:
The adhesive member incorporates particles with non-uniform distribution where the concentration of particles varies in different regions. Specifically, the particle concentration is higher near the marginal portion and lower toward the center, creating local variations in viscosity and surface tension that suppress wet-spreading at the edges while maintaining bonding strength in the bonding region
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Effectively prevents contamination and ensures strong connections between the base body and semiconductor element, reducing electrical open defects and heat radiation issues while allowing for high-density mounting.
Implementation Method 1
at least a part of the marginal portion of the adhesive member is a region where the particles are unevenly distributed
Implementation Method 2
suppressing wet-spreading through capillary forces and convection currents
Data Source
Figure 1A~1B
Figure 2A~2B
Figure 3A~3B
AI summary
The present invention provides a semiconductor device in which wet-spreading of an adhesive member for bonding the semiconductor element on a base body is suppressed. The semiconductor device (100) of the present invention is a semiconductor device including a base body (10), and a semiconductor element (20) bonded on the base body via an adhesive member (30), wherein the adhesive member (30) contains surface-treated particles (40), or particles (40) that coexist with a dispersing agent, and at least a part of the marginal portion (301) of the adhesive member is a region where the particles (40) are unevenly distributed.