Semiconductor Heat Spreader Layer Between Circuit and Die Attach
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing semiconductor packages face challenges in thermal performance due to high thermal resistance and non-uniform power distribution, leading to hot spots and degradation of integrated circuit components.
Innovation Solution
Incorporation of a heat spreader layer between the die attach layer and the first circuit to dissipate heat laterally, using materials with higher thermal conductivity than the die attach layer, such as graphene, to reduce thermal resistance and distribute heat evenly.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a die attach layer is used to couple the circuit to the substrate, then electrical connectivity and mechanical support are provided, but thermal resistance increases and heat dissipation performance deteriorates
Solution Approach 1:
A heat spreader layer is introduced as an intermediary component between the die attach layer and the first circuit. This heat spreader layer has higher thermal conductivity than the die attach layer, serving as a thermal bridge that conducts heat away from the circuit while allowing the die attach layer to maintain its electrical and mechanical functions.
Solution Approach 2:
The patent employs a composite structure combining the die attach layer (providing electrical and mechanical support) with a heat spreader layer made of thermally conductive materials. This composite approach allows simultaneous optimization of electrical connectivity, mechanical support, and thermal management properties.
2Reliability
If power distribution is concentrated in specific areas to meet circuit requirements, then functional performance is improved, but hot spots are formed and thermal performance deteriorates
Solution Approach 1:
The heat spreader layer provides localized thermal management by being positioned directly beneath areas of high power dissipation. The layer has spatially varying thermal conduction properties that match the power distribution pattern, efficiently conducting heat away from hot spots while maintaining circuit functionality.
Solution Approach 2:
The patent converts the harmful concentration of heat in hot spots into a beneficial distributed thermal profile. The heat spreader layer takes the concentrated heat generation from active circuit areas and redistributes it laterally, transforming the harmful thermal concentration into a manageable thermal distribution that improves overall device reliability.
3Power
If high-power applications are implemented to meet increasing demand, then power output is improved, but thermal management becomes more difficult and component reliability deteriorates
Solution Approach 1:
The patent addresses thermal management in high-power applications by introducing a lateral heat dissipation dimension. The heat spreader layer conducts heat laterally in the plane of the circuit, providing an additional thermal management pathway that complements vertical heat dissipation through the die attach layer, enabling effective cooling in high-power applications.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The heat spreader layer effectively reduces thermal resistance and distributes heat laterally, minimizing hot spots and improving the performance and longevity of integrated circuit components.
Implementation Method 1
The heat spreader layer can be configured to dissipate heat laterally along a side of the first circuit coupled to the heat spreader layer
Data Source
Figure 1
Figure 2
Figure 3
AI summary
The subject technology is directed to semiconductors and fabrication methods thereof. The subject technology provides a first circuit, a die attach film coupled to a bottom side of the first circuit, and a heat spreader layer coupled between the first circuit and the die attach film. In some cases, the heat spreader layer is directly coupled to at least one of the first circuit or the die attach film. In some cases, the first layer or the die attach film is non-conductive. The heat spreader layer can be configured to dissipate heat laterally along a side of the first circuit. There are other embodiments as well.