Die Attach Calibration Using Verification Substrate Imaging
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Solution Overview
Problem
Conventional die attach systems lack efficient methods for real-time accuracy verification and calibration, leading to time-consuming and costly post-operation accuracy determinations.
Innovation Solution
Integration of a verification substrate with substrate reference markers and an imaging system within the die attach system to determine the alignment of die with the substrate, allowing for real-time accuracy verification and calibration.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If conventional separate equipment is used for accuracy determination after die attach operation, then measurement capability is provided, but time consumption and cost increase
Solution Approach 1:
The patent merges the accuracy verification function with the die attach system by integrating an imaging system and verification substrate directly into the bonding head and substrate stage. This eliminates the need for separate post-operation measurement equipment, enabling real-time accuracy verification during the die attach process itself, thereby reducing calibration time while maintaining measurement precision.
Solution Approach 2:
The verification substrate with reference markers is prepared in advance and integrated into the substrate stage before the die attach operation begins. The imaging system is pre-configured to capture images of these markers during the process, allowing accuracy verification to be performed preliminarily and continuously rather than as a separate post-operation step.
2Measurement precision
If conventional separate equipment is used for accuracy determination, then measurement capability is provided, but system complexity and cost increase
Solution Approach 1:
The patent combines multiple functions (die attach, imaging, and accuracy verification) into a single integrated system. The imaging system and verification substrate are incorporated into the existing die attach apparatus, eliminating the need for separate external measurement equipment and reducing overall system complexity while maintaining accurate measurement capability.
Solution Approach 2:
The imaging system serves multiple purposes: it captures images of the die and substrate for alignment verification, images the reference markers on the verification substrate for accuracy determination, and can potentially be used for other process monitoring functions. This multi-functionality reduces the need for dedicated separate equipment.
3Loss of time
If real-time accuracy verification is implemented, then calibration time is reduced, but system complexity increases
Solution Approach 1:
The real-time accuracy verification is achieved by merging the imaging system with the existing die attach process. The same imaging system used for die alignment can capture images of the verification substrate markers, enabling continuous accuracy monitoring without adding separate verification equipment or significantly increasing system complexity.
Solution Approach 2:
The system performs self-verification by using its own imaging system to capture images of the verification substrate with reference markers. The imaging system automatically processes these images to determine accuracy, eliminating the need for external measurement equipment and reducing the complexity burden of real-time verification.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables immediate feedback and correction during the die attach process, reducing errors and improving accuracy without the need for additional measurement equipment, thus shortening calibration/verification loops.
Implementation Method 1
an imaging system for determining an alignment of the plurality of die with the verification substrate by imaging each of the plurality of die with respective ones of the plurality of substrate reference markers
Data Source
AI summary
A method of operating a die attach system is provided. The method includes the step of providing a verification substrate configured to receive a plurality of die, the verification substrate including a plurality of substrate reference markers. The method also includes the step of imaging each of the plurality of die with respective ones of the plurality of substrate reference markers using an imaging system of the die attach system for determining an alignment of the plurality of die with the verification substrate.