Die Attach Paddle With Etched Channels For Controller Die Suspension
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Solution Overview
Problem
Integrated circuit packages face failures due to silicon splinters and ejector pin holes in the die attach film layer creating electrical paths between the controller die and the die attach paddle, leading to short circuits and package failure.
Innovation Solution
The die attach paddle is half etched with intersecting channels to suspend the peripheral portion of the controller die, preventing silicon splinters from contacting the paddle and creating open spaces to avoid electrical paths, thus eliminating potential failures.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the controller die is mounted directly on the die attach paddle with nonconductive epoxy, then the package structure is simple and manufacturing is easy, but silicon splinters and ejector pin holes can create electrical paths causing short circuits
Solution Approach 1:
The die attach paddle is divided into multiple sections by etching intersecting channels that create isolated islands. The controller die is positioned over these etched regions, suspending it above the paddle surface. This segmentation prevents electrical paths from forming through the paddle, as the conductive material is interrupted by the etched channels, thereby eliminating short circuit risks while maintaining structural integrity.
Solution Approach 2:
The paddle structure is modified locally by etching channels only in specific regions where electrical isolation is needed. The etched channels are positioned beneath the controller die to create suspension, while other areas of the paddle remain intact. This localized modification provides electrical isolation precisely where required without unnecessarily complicating the overall paddle structure.
2Reliability
If etched channels are added to the die attach paddle to suspend the controller die, then electrical isolation is improved, but manufacturing complexity increases
Solution Approach 1:
The etched channels are incorporated into the paddle during the leadframe fabrication process, before the dies are mounted. This preliminary action allows the channels to be formed as part of the standard manufacturing workflow, integrating the electrical isolation feature into the base structure without requiring separate post-processing steps. The channels are etched into the paddle substrate, creating the suspension structure that prevents electrical paths before assembly occurs.
3Reliability
If the controller die is suspended over etched channels, then short circuit prevention is enhanced, but the device structure becomes more complex
Solution Approach 1:
The conductive material is selectively removed by etching channels from the paddle structure beneath the controller die. This extraction of material creates voids or channels that interrupt potential electrical paths. The controller die is positioned over these extracted regions, suspending it above the paddle. By taking out the conductive material where it would create harmful electrical paths, the structure achieves electrical isolation while maintaining overall structural simplicity.
Data Source
AI summary
An integrated circuit package having a die attach paddle, a power die mounted on the die attach paddle and a controller die mounted on the die attach paddle. The die attach paddle has at least one recessed portion at least partially underlying the controller die.