Die Attach Paddle With Middle Channels For IC Package
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Solution Overview
Problem
Integrated circuit packages face failures due to silicon splinters and ejector pin holes in the die attach film layer creating electrical paths between the controller die and the die attach paddle, leading to short circuits.
Innovation Solution
The die attach paddle is half etched with intersecting channels to suspend the peripheral portion of the controller die, preventing silicon splinters from contacting the paddle and creating an open space to avoid electrical paths, thus eliminating potential short circuits.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the die attach paddle is half etched with intersecting channels to suspend the peripheral portion of the controller die, then reliability is improved by preventing short circuits caused by silicon splinters and ejector pin holes, but device complexity increases due to the additional etched channels
Solution Approach 1:
The die attach paddle is segmented by etching intersecting channels that divide the paddle surface into separate regions. These channels create distinct zones that suspend the controller die periphery, preventing electrical contact between silicon splinters/ejector pin holes and the paddle, thus eliminating short circuit paths while maintaining structural integrity.
Solution Approach 2:
The harmful conductive paths are extracted by removing material to form etched channels. These channels extract the potential short circuit paths from the system by creating physical separations that prevent silicon splinters and ejector pin holes from establishing electrical connections between the controller die and the die attach paddle.
2Adaptability or versatility
If multiple dies are mounted on the die attach paddle with different adhesive types, then functionality is improved by enabling both power and controller dies to be attached, but manufacturing complexity increases due to requiring different adhesive application processes
Solution Approach 1:
Different regions of the die attach paddle are assigned different local qualities through the etched channel pattern. The areas under the power die and controller die have different adhesive requirements, and the etched channels create distinct zones that allow separate adhesive application processes for each die type, enabling concurrent mounting of power and controller dies with appropriate adhesives for each.
Data Source
AI summary
A method of making an integrated circuit package. A leadframe having a die attach paddle surrounded by lead portions is formed. Middle channels underlying in said die attach paddle portion in a region thereof adapted to receive a first die are formed.