Die Attach Adhesive Film Sheet Peeling Without Lamination Defects
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Solution Overview
Problem
Existing methods for producing die attach adhesive sheets suffer from high defect rates due to issues with peeling off the adhesive layer from the release substrate, leading to incomplete lamination and increased failure rates during wafer lamination processes.
Innovation Solution
A method involving a multi-layer structure with z-directional indentations in the release substrate, followed by replacing the first release substrate with a second release substrate without incisions, ensuring smooth peeling and reduced defects.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If an incision is formed in the release substrate from the adhesive layer side, then the adhesive layer can be positioned during lamination, but the adhesive layer becomes bitten by the incision and the interface is sealed, making peeling difficult and causing defects
Solution Approach 1:
The patent inverts the conventional approach by forming the incision in the release substrate from the opposite side (adhesive layer side) rather than from the substrate side. This inversion prevents the incision from biting into and sealing the adhesive layer interface, allowing successful peeling while maintaining positioning accuracy during lamination
Solution Approach 2:
The patent segments the release substrate by forming an incision that divides it into separate regions. This segmentation allows the adhesive layer to be positioned in the incised area during lamination while maintaining the ability to peel the adhesive layer from the release substrate without the incision interfering with the peeling process
2Manufacturing precision
If the incision depth is increased to improve positioning, then the adhesive layer is more effectively positioned, but the interface sealing effect increases, making peeling more difficult
Solution Approach 1:
By inverting the incision formation approach and making it from the adhesive layer side, the patent achieves effective positioning without the harmful sealing effect that increases with deeper incisions from the substrate side. The inverted incision geometry prevents interface sealing even at greater depths
3Manufacturing precision
If precut processing is performed with deep blade insertion, then the adhesive sheet is precisely formed, but the tacky-adhesive layer is bitten by the incision and the interface is sealed, causing peel defects
Solution Approach 1:
The patent applies the inversion principle to the precut processing by forming the incision from the adhesive layer side during cutting. This allows precise cutting and positioning while preventing the blade from biting into and sealing the interface between the tacky-adhesive layer and release substrate, thereby eliminating peel defects
Data Source
AI summary
Provided herein is a method for producing a die attach adhesive film sheet, comprising:Providing a first release substrate layer, a die attach adhesive layer, and a dicing tape layer, and joining the first release substrate layer, the die attach adhesive layer, and the dicing tape layer in that order to form a multi-layer structure;Working the multi-layer structure to form a circular preformed die attach adhesive film sheet, wherein during said working the first release substrate receives a z-directional indentation therein; andRemoving the first release substrate with the z-directional indentation therein from the die attach adhesive layer, and placing in its stead a second release substrate in contact with the die attach adhesive layer.