Die Attachment Structure With Dual Adhesive Layers for Heat and Insulation
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Solution Overview
Problem
Current die attachment processes face challenges in achieving both effective insulation and heat dissipation due to issues with adhesive thickness control and void formation, particularly in high-voltage applications, leading to potential breakdown failures.
Innovation Solution
A die attachment structure involving multiple adhesive layers formed by different processes, where a first adhesive layer is applied on the die back surface and a second layer covers the sidewalls, ensuring uniform thickness and high thermal conductivity, while a groove structure on the base enhances heat dissipation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If adhesive-dispensing process is used to improve heat dissipation, then thermal conductivity is improved, but adhesive thickness control deteriorates and voids are produced
Solution Approach 1:
The adhesive application is segmented into two distinct processes: adhesive-dispensing for the bottom layer (prioritizing heat dissipation) and adhesive-brushing or DAF film for the sidewall layer (prioritizing thickness control and void elimination). This segmentation allows each process to optimize for its specific function without compromising the other.
Solution Approach 2:
Different adhesive application methods are applied to different locations of the die: the bottom surface receives adhesive-dispensing for maximum thermal conductivity, while the sidewalls receive adhesive-brushing or DAF film for uniform thickness and void-free coverage. Each location receives the quality of adhesive application most suited to its functional requirements.
2Reliability
If adhesive-brushing process or DAF film is used to improve insulation reliability, then thickness control is improved, but thermal conductivity deteriorates
Solution Approach 1:
The thermal management function is segmented between two adhesive layers: the bottom adhesive layer (applied by adhesive-dispensing) provides the primary heat dissipation path with high thermal conductivity, while the sidewall adhesive layer (applied by adhesive-brushing or DAF film) provides insulation reliability with controlled thickness and no voids.
Solution Approach 2:
The patent merges two different adhesive application processes into a single integrated solution where both processes work together to achieve the dual objectives of heat dissipation and insulation. The combination of adhesive-dispensing and adhesive-brushing/DAF film creates a composite adhesive structure that leverages the strengths of both methods.
3Device complexity
If single adhesive layer is used to simplify structure, then device complexity is reduced, but both insulation and heat dissipation performance deteriorate
Solution Approach 1:
The adhesive system is segmented into functionally distinct layers: the bottom adhesive layer optimized for thermal conduction to the substrate, and the sidewall adhesive layer optimized for electrical insulation and mechanical support. This functional segmentation enables simultaneous optimization of both heat dissipation and insulation without requiring complex multi-material systems.
Solution Approach 2:
The two-layer adhesive structure achieves multi-functionality: the bottom layer serves primarily as a thermal path, the sidewall layer serves primarily as an insulator, and together they provide mechanical bonding, electrical isolation, and thermal management. This multi-functional design eliminates the need for additional separate components.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The structure provides improved insulation and heat dissipation capabilities by controlling adhesive thickness and reducing voids, enhancing the reliability of high-voltage die packages.
Implementation Method 1
a first adhesive layer located on a back surface of the die, and a second adhesive layer at least covering the sidewalls of the die... ensuring uniform thickness and high thermal conductivity
Data Source
AI summary
A die attachment structure can include: a base; a die located above a first surface of the base; a first adhesive layer located on a back surface of the die, wherein the die is pasted on the first surface of the base at least by the first adhesive layer; and a second adhesive layer at least partially covering the sidewalls of the die.