Multi-layer die attachment using 2-in-1 film to reduce contamination
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Solution Overview
Problem
Conventional semiconductor die packaging processes face challenges with contamination, high costs, and manufacturing yield issues due to the use of multiple layers of printed die attach material, which can lead to electrical failures and inefficiencies.
Innovation Solution
The use of a 2-in-1 die attach film with a spongy saw tape release film and an adhesive layer, applied using a lamination technique, reduces the need for a second layer of printed die attach material, minimizing contamination and costs, and improving manufacturing efficiency by using a single layer with minimal fillers and a controlled application process.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If multiple layers of printed die attach material are used, then the die attachment process is conventional and well-established, but contamination increases and manufacturing yield decreases
Solution Approach 1:
The patent combines the die attach adhesive function and the release film function into a single integrated layer. The die attach film includes an adhesive layer for bonding the die to the substrate and a release film layer that facilitates die release during packaging, eliminating the need for separate printed die attach material layers and reducing contamination risks.
Solution Approach 2:
The patent extracts and eliminates the need for multiple layers of printed die attach material by using a pre-formed die attach film with integrated release properties. This removes the printing process and associated contamination sources while maintaining the necessary adhesive functionality.
2Ease of manufacture
If multiple layers of printed die attach material are used, then the process is conventional, but costs increase due to materials and process complexity
Solution Approach 1:
The patent merges multiple functional layers (adhesive layer and release film) into a single integrated die attach film structure, reducing the total number of material layers from multiple printed layers to one pre-formed film with combined functionalities.
Solution Approach 2:
The die attach film performs multiple functions simultaneously: it provides adhesive bonding between the die and substrate, acts as a release film during packaging processes, and eliminates the need for separate printing operations, thereby simplifying the manufacturing process.
3Reliability
If a second layer of printed die attach material is used, then conventional die attachment is achieved, but voids and debris are introduced causing electrical failures
Solution Approach 1:
The patent removes the second layer of printed die attach material entirely by using a single integrated die attach film with built-in release properties, eliminating the source of voids and debris that would otherwise be introduced during multiple printing and layering operations.
Solution Approach 2:
The die attach film is designed as a single-use, pre-formed component that is applied once and then serves its complete function, replacing the need for multiple printed layers that require complex processing and can introduce contaminants during each printing operation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach results in cost savings, improved manufacturing yield, and reduced contamination risks, enhancing the reliability of packaged electrical devices by eliminating voids and debris that can cause electrical failures.
Implementation Method 1
an adhesive layer 50 that was applied using a lamination technique
Implementation Method 2
a spongy saw tape release film
Data Source
AI summary
A packaged electrical device that includes a cured adhesive layer and a cured layer of die attach material coupled between a semiconductor die and a substrate. The packaged electrical device may also include wire bonds coupled between the substrate and leads of the semiconductor die. In addition, the packaged electrical device may be encapsulated in molding compound. A method for fabricating a packaged electrical device. The method includes printing a layer of die attach material over a semiconductor wafer and applying a layer of 2-in-1 die attach film over the layer of die attach material. The method also includes singulating the semiconductor wafer to create a semiconductor die and placing the semiconductor die onto a substrate. In addition the method includes wire bonding the substrate to leads of the semiconductor die and encapsulating the device in molding compound.