Die-Based Vehicle Controller Semiconductor Integration

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Solution Overview

Problem

Conventional semiconductor development methods for vehicle controllers, such as SOC and SIP, face challenges including high development costs, prolonged development periods, hardware resource wastage, and software compatibility issues, leading to increased vehicle size, weight, and decreased fuel efficiency due to complex and massive ECU designs.

Innovation Solution

A die-based vehicle controller-only semiconductor design method that integrates common functions from multiple dies into a single chip using a wire bonding and molding technique, allowing for hardware reuse and simplification, while unifying software platforms for efficient and compact semiconductor systems.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Adaptability or versatility

If multiple complete chips are integrated onto one board to increase functionality, then the functionality and convenience of vehicle controllers is improved, but the vehicle size and weight increase, and fuel efficiency decreases

Engineering Contradiction:

ImprovefunctionalityVSAvoidvehicle weight

Core Design Contradiction:

Adaptability or versatilityVSWeight of stationary object

Solution Approach 1:

The patent merges multiple separate chips (core chip, power chip, communication chip, memory chip) into a single integrated semiconductor device. This consolidation maintains all required functionalities while reducing the overall number of components, thereby decreasing vehicle weight and improving fuel efficiency without sacrificing adaptability or versatility.

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The integrated semiconductor device is designed to perform multiple functions simultaneously by incorporating different functional units within a single chip. This multi-functional approach allows the device to replace multiple separate chips, reducing system complexity and weight while maintaining comprehensive functionality for vehicle control applications.

Inventive Principle:

Principle #6Universality (Multi-functionality)

2Area of stationary object

If SOC or SIP techniques are used to integrate multiple functionalities into fewer chips, then vehicle controller size is reduced, but development cost increases and development period is prolonged

Engineering Contradiction:

Improvecontroller sizeVSAvoiddevelopment cost

Core Design Contradiction:

Area of stationary objectVSEase of manufacture

Solution Approach 1:

The patent segments the integrated semiconductor device into distinct functional units (core unit, power unit, communication unit, memory unit) that can be independently designed and manufactured. This segmentation allows each unit to be optimized separately using appropriate technologies (SOC for core, SIP for power and communication), reducing overall development cost and complexity while achieving compact integration.

Inventive Principle:

Principle #1Segmentation

3Adaptability or versatility

If conventional semiconductor development methods are used, then software compatibility is maintained, but hardware resource wastage occurs and development effectiveness decreases

Engineering Contradiction:

Improvesoftware compatibilityVSAvoidhardware resource wastage

Core Design Contradiction:

Adaptability or versatilityVSLoss of substance

Solution Approach 1:

The patent applies different integration strategies to different functional units based on their specific requirements. The core unit uses SOC technique for high integration, while power and communication units use SIP technique for better performance. This localized approach optimizes hardware resource utilization for each function while maintaining overall software compatibility, eliminating unnecessary hardware wastage.

Inventive Principle:

Principle #3Local quality

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach reduces development costs, minimizes hardware overlap, and enhances fuel efficiency by creating a compact, lightweight, and high-performance semiconductor system that can be quickly adapted for various applications, improving EMC protection and reducing the overall size and weight of vehicle controllers.

Implementation Method 1

integrates common functions from multiple dies into a single chip using a wire bonding and molding technique

Methodology Applied

Scientific EffectWire bonding: Soldering

Implementation Method 2

integrates common functions from multiple dies into a single chip using a wire bonding and molding technique

Methodology Applied

Scientific EffectMolding:

Data Source

PatentUS10903199B2Method for designing vehicle controller-only semiconductor based on die and vehicle controller-only semiconductor by the same

Publication Date: 2021.01.26 HYUNDAI MOBIS CO LTD

AI summary

The present invention relates to a method for designing a die-based vehicle controller-only semiconductor and a vehicle controller-only semiconductor manufactured by the same, and breaks the conventional semiconductor process to design and manufacture a novel conceptual vehicle controller-only semiconductor, EIP (ECU in Package), through a fusion of a new semiconductor process technique with a controller system technique, thereby obtaining an effect of capable of implementing a high performance/high quality semiconductor in micro-miniature size/ultra-light weight in a short time period.