Die-Between-Substrates Power Module Layout for Low Inductance
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Solution Overview
Problem
Conventional electronic devices, such as power modules, face performance bottlenecks due to high inductance and losses from complex electrical paths, and often sacrifice thermal management for electrical performance, with wire bond connections prone to failure under harsh conditions.
Innovation Solution
An electronic device design where a die is mounted between two substrates with conductive structures for improved electrical and heat flow, eliminating the need for certain wire bonds, additional traces, or dedicated power terminals, using multi-layer substrates with metal inlays and vias for heat and signal transfer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If wire bonds and copper traces are used to electrically connect power MOSFETs to external terminals, then electrical isolation and connection flexibility are improved, but loop inductance increases and electrical performance deteriorates
Solution Approach 1:
The patent merges the electrical connection function and thermal management function into a single integrated substrate structure. The substrate simultaneously serves as the electrical interconnection medium (replacing wire bonds and traces) and as the thermal conduction path to the heatsink, eliminating the need for separate connection elements and reducing overall loop inductance.
Solution Approach 2:
The substrate is designed to perform multiple functions: electrical isolation between power MOSFETs and heatsink, electrical connection to external terminals, and thermal conduction to the heatsink. This multi-functional design eliminates the need for dedicated wire bonds and traces, reducing the electrical path length and loop inductance while maintaining all necessary functions.
2Reliability
If ceramic substrates are used for electrical isolation between power MOSFETs and heatsink, then electrical isolation is improved, but thermal management performance deteriorates
Solution Approach 1:
The patent employs a composite substrate structure that combines materials with different properties: the substrate material provides electrical isolation between the power MOSFETs and heatsink while simultaneously maintaining thermal conduction capability. This composite approach allows the substrate to perform both electrical isolation and thermal management functions effectively, overcoming the limitation of conventional ceramic substrates that prioritize electrical isolation over thermal performance.
3Temperature
If busbars are located spaced apart from power electronics, then physical interference with thermal management structures is avoided, but electrical performance deteriorates due to high inductance
Solution Approach 1:
The patent transitions from a conventional planar arrangement where busbars are spaced apart from the electronics to a three-dimensional integrated structure. The substrate vertically integrates the power MOSFETs, electrical connection paths, and thermal management structures, allowing electrical connections to be made directly at the die level while thermal management occurs through the substrate thickness, effectively resolving the spatial conflict between electrical and thermal requirements.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration reduces loop inductance and enhances both thermal management and electrical signal communication, making the power module more efficient and reliable for applications like electric vehicles and power infrastructure.
Implementation Method 1
The respective substrates (between which the die(s) are mounted) may include electrically and thermally conductive structures facilitating heat transfer from away the die(s)
Implementation Method 2
The respective substrates (between which the die(s) are mounted) may include electrically and thermally conductive structures facilitating heat transfer from away the die(s) and communication of electrical signals to and/or from the die(s)
Data Source
AI summary
An electronic device includes a die mounted between a first substrate and a second substrate. The first substrate includes a first substrate die contact on a first side of the first substrate, and a first substrate terminal contact on a second side of the first substrate opposite the first side, the first substrate terminal contact electrically and thermally connected to the first substrate die contact. The second substrate includes a second substrate die contact on a first side of the second substrate, and a second substrate terminal contact on a second side of the second substrate opposite the first side, the second substrate terminal contact electrically and thermally connected to the second substrate die contact. The die includes a first die element conductively connected to the first substrate die contact, and a second die element conductively connected to the second substrate die contact.