Semiconductor Die Boat Locking Assembly for Precise Chamber Handling
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Solution Overview
Problem
The complexity of modern semiconductor fabrication processes requires improved automation and reduced manual intervention for efficient handling and processing of semiconductor dies, particularly in forming and securing assemblies within process chambers.
Innovation Solution
A system and method involving an assembler that retrieves and separates jigs into portions, positions a boat supporting a die between these portions, and uses a robotic system to secure and transport the assembly to a process chamber, applying a controlled torque to lock the assembly, which is then subjected to fabrication operations, and subsequently released for further processing or removal.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If automated robotic systems are used to assemble and transport semiconductor dies, then productivity and manufacturing efficiency are improved, but device complexity increases due to the need for sophisticated robotic manipulation and locking mechanisms
Solution Approach 1:
The system divides the semiconductor die handling process into distinct modular components: jigs are separated into first and second portions, the boat is positioned as a separate element, and the locking mechanism operates independently. This segmentation allows each component to be optimized for its specific function while reducing overall system complexity.
Solution Approach 2:
The robotic system performs self-contained operations including automatic retrieval of jigs from storage, separation of jig portions, positioning of the boat, manipulation of the locking system, and transport to the process chamber. The system serves itself through automated control without requiring external manual intervention at each step.
2Manufacturing precision
If precise alignment and secure locking mechanisms are implemented, then manufacturing precision is improved, but device complexity increases due to additional alignment and locking components
Solution Approach 1:
The system performs preliminary alignment and positioning actions before the actual assembly is complete. The first jig portion and second jig portion are pre-positioned and aligned, the boat is pre-positioned with the semiconductor die, and the locking system is pre-configured. This preliminary action ensures precision is achieved before final assembly, reducing the need for complex real-time adjustment mechanisms.
Solution Approach 2:
The locking system acts as an intermediary mechanism that secures the alignment between the first jig portion, second jig portion, and boat. Rather than requiring direct complex interlocking between all components, the locking system mediates the connection, maintaining precise alignment while simplifying the overall assembly structure.
3Loss of time
If automated retrieval and storage systems are used for jigs, then loss of time is reduced through efficient inventory management, but device complexity increases due to storage infrastructure
Solution Approach 1:
The jig storage system is designed to store multiple jigs in an organized array format, allowing the robotic system to retrieve any required jig from the storage array. This multi-functional storage infrastructure serves both as inventory management and as part of the automated workflow, reducing cycle time without requiring separate dedicated storage areas for each jig type.
Data Source
AI summary
A system and computer-implemented method are provided for manufacturing a semiconductor electronic device. An assembler receives a jig and a boat supporting a die. The assembler includes a separator that separates the jig into a first jig portion and a second jig portion and a loader that positions the boat between the first jig portion and the second jig portion. A robot receives an assembly prepared by the assembler and manipulates a locking system that fixes an alignment of the boat relative to the first jig portion and the second jig portion to form a locked assembly. A process chamber receives the locked assembly and subjects the locked assembly to a fabrication operation.