Die Bonder Bond Head Alignment Using Multi-Axis Actuators
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Solution Overview
Problem
The alignment of the bond head and bond stage in die bonders is critical for ensuring the quality and reliability of the die bonding process, as small deviations can result in side forces and placement errors due to the small dimensions of solder or gold bumps on semiconductor dies, compromising the bonding process.
Innovation Solution
A bond head alignment apparatus with a connecting member and actuators that rotate the bonding tool relative to the die bonder's main body about multiple axes to ensure parallelism with the bond stage, utilizing solenoid actuators and linear encoders for precise alignment.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If the bonding tool and bond stage are manually aligned, then the alignment process is simple, but the alignment precision is insufficient leading to placement errors
Solution Approach 1:
The patent replaces manual mechanical alignment with an automated alignment system using linear encoders for precise position detection and solenoid actuators for automatic adjustment. This substitutes human-operated mechanical procedures with an automated electromechanical system, achieving sub-micron alignment precision while maintaining manageable device complexity through modular design.
2Manufacturing precision
If the alignment precision is increased to sub-micron level, then the die bonding quality is improved, but the device complexity increases due to multiple actuators and encoders
Solution Approach 1:
The patent employs linear encoders to detect positional deviations with sub-micron resolution and solenoid actuators to correct alignment errors automatically. This electromechanical substitution enables precise die bonding (placing bumps within 10 microns of target) while managing system complexity through automated feedback control, eliminating the need for complex manual adjustment mechanisms.
Solution Approach 2:
The alignment system uses linear encoders to continuously monitor the positions of the bonding tool and bond stage, providing real-time feedback to the control system. This feedback mechanism enables automatic correction of alignment deviations through solenoid actuators, achieving consistent sub-micron precision across multiple bonding operations without increasing operational complexity.
3Reliability
If manual alignment is used, then the device complexity is low, but side forces are generated during bonding compromising reliability
Solution Approach 1:
The patent replaces manual alignment procedures with an automated system using linear encoders and solenoid actuators that can achieve and maintain precise parallelism between the bonding tool and bond stage. This eliminates human error and the generation of side forces during bonding, significantly improving die bonding reliability while managing device complexity through modular, automated components.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution ensures high accuracy and reliability of the die bonding process by maintaining the parallelism of the bond head and bond stage surfaces, preventing misalignment and placement errors, thereby enhancing the quality of semiconductor die bonding.
Implementation Method 1
utilizing solenoid actuators and linear encoders for precise alignment
Implementation Method 2
utilizing solenoid actuators and linear encoders for precise alignment
Data Source
AI summary
An apparatus for aligning a bonding tool of a die bonder with respect to a bond stage is disclosed. The apparatus comprises: a connecting member to which the bonding tool is coupleable such that the connecting member is located between the bonding tool and a main body of a die bonder; and a plurality of actuators engaged to the connecting member. In particular, the plurality of actuators are actuable to rotate the connecting member and the bonding tool relative to the main body of the die bonder about a plurality of axes, to align the bonding tool with respect to the bond stage.