Die Bonder Collet Cleaning via Dicing Tape Adhesion
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Solution Overview
Problem
Conventional die bonder processes require frequent collet cleaning, leading to reduced operating efficiency due to the need for additional units like air blowing or brushing mechanisms, which are ineffective for removing foreign substances with high adhesive power and risk scattering debris onto the product.
Innovation Solution
A method and apparatus for cleaning the collet by moving it to a predetermined position on the dicing tape where no dies are present, allowing foreign substances to be removed without additional units, utilizing the adhesive surface of the dicing tape to adhere and remove substances before die pickup operations.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If additional units like air blowing or brushing mechanisms are added to remove foreign substances from the collet, then the cleaning capability is improved, but the device complexity and operating efficiency deteriorate due to scattered debris and ineffective removal of highly adhesive substances
Solution Approach 1:
The patent introduces a cleaning tape as an intermediary medium between the collet and the cleaning mechanism. The cleaning tape, with its adhesive surface, acts as a mediator that transfers foreign substances from the collet to the tape, enabling effective cleaning without direct contact between the collet and complex cleaning mechanisms like air blowers or brushes.
Solution Approach 2:
The patent replaces complex mechanical cleaning systems (air blowing mechanisms, brushing mechanisms) with a simpler adhesive-based cleaning system. Instead of using mechanical force to remove foreign substances, the system uses the adhesive property of the cleaning tape to pick up and remove contaminants from the collet surface.
2Device complexity
If air blowing or brushing mechanisms are used to remove foreign substances, then the cleaning process is simplified, but the effectiveness deteriorates for substances with high adhesive power and risks scattering debris onto the product
Solution Approach 1:
The cleaning tape serves as an intermediary that captures foreign substances through adhesion. This mediator approach allows the system to handle highly adhesive contaminants effectively without scattering them, as the tape's adhesive surface securely holds the contaminants during the cleaning process.
Solution Approach 2:
The patent changes the cleaning mechanism from mechanical (air blowing, brushing) to chemical/adhesive-based. By utilizing the adhesive property of the cleaning tape, the system can remove substances with high adhesive power that cannot be effectively removed by mechanical means, thereby improving cleaning effectiveness.
3Reliability
If the collet is frequently dismounted for cleaning, then the cleanliness is maintained, but the operating rate of the apparatus deteriorates
Solution Approach 1:
The patent implements preliminary cleaning action by integrating the cleaning process into the die bonding operation. The cleaning tape is positioned to clean the collet during the normal bonding cycle, performing cleaning in advance before foreign substances can accumulate to problematic levels, thereby maintaining cleanliness without stopping production.
Solution Approach 2:
The patent ensures continuous cleaning action by positioning the cleaning tape in the path of the collet during normal operation. The cleaning process occurs continuously alongside the die bonding process, eliminating the need to stop production for periodic cleaning and maintaining uninterrupted useful action.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables reliable removal of foreign substances with high adhesive power without scattering, improving operating efficiency and product quality by integrating collet cleaning into the die bonding process without requiring new units.
Implementation Method 1
utilizing the adhesive surface of the dicing tape to adhere and remove substances
Data Source
AI summary
An object of the present invention is to provide a collet cleaning method and a die bonder using the same in which a collet can be cleaned without adding a new unit, and foreign substances with 5 high adhesive power can be reliably removed without scattering the foreign substances. A die bonder includes a pickup device, a bonding head unit having a collet that absorbs dies from a wafer at the timing of lifting of the pickup device, and a control unit that controls the pickup device 10 and the bonding head unit. The collet is moved to a position of a dicing tape at which no dies of the wafer held by a wafer ring exist to be brought into contact with the adhesive surface of the dicing tape, so that foreign substances attached to the tip end of the collet are removed.