Die Bonder Bond Collet Cleaning via Movable Platform

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Solution Overview

Problem

Existing die bonder cleaning methods, such as manual solvent and clean room cloth usage, are inefficient and can damage bond collets due to air-blowing contaminants and stiff brushes, leading to reduced productivity and potential damage to the bond collet tips.

Innovation Solution

A die bonder equipped with a movable cleaning platform and an antistatic pump that supplies a cleaning agent to a textile material, such as a clean room cloth, to facilitate automatic and gentle cleaning of the bond collet, minimizing contact damage and optimizing cleaning efficiency.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If manual cleaning with solvent and clean room cloth is used, then cleaning effectiveness is achieved, but cleaning time increases and productivity decreases

Engineering Contradiction:

Improvecleaning effectivenessVSAvoidmachine utilization

Core Design Contradiction:

ReliabilityVSProductivity

Solution Approach 1:

The bond collet automatically cleans itself by contacting the cleaning surface during its normal movement between wafer ring and lead frame, eliminating the need for separate manual cleaning operations. The system uses the bond collet's own motion to facilitate the cleaning process without requiring machine shutdown.

Inventive Principle:

Principle #25Self-service

Solution Approach 2:

The cleaning surface is pre-prepared with cleaning agent before the bond collet arrives, so that when the bond collet contacts the cleaning surface, the cleaning action can immediately occur without delay. This ensures cleaning is performed proactively before adhesive residues affect bonding quality.

Inventive Principle:

Principle #10Preliminary action

2Productivity

If air blowing is used to remove chip residues, then cleaning speed increases, but particles are blown to the bond area causing contamination

Engineering Contradiction:

Improvecleaning speedVSAvoidbond area contamination

Core Design Contradiction:

ProductivityVSObject-affected harmful factors

Solution Approach 1:

A cleaning surface with cleaning agent acts as an intermediary between the bond collet and the cleaning process. Instead of directly blowing air onto the bond collet, the cleaning agent on the surface facilitates residue removal through contact, preventing particle generation and contamination of the bond area.

Inventive Principle:

Principle #24Intermediary (Mediator)

3Reliability

If stiff brush is used for cleaning, then cleaning effectiveness improves, but bond collet tip damage occurs

Engineering Contradiction:

Improvecleaning effectivenessVSAvoidbond collet tip integrity

Core Design Contradiction:

ReliabilityVSStrength

Solution Approach 1:

The cleaning surface uses a soft material with appropriate surface properties (friction coefficient, hardness) that differ from traditional stiff brushes. By changing these parameters, the system achieves effective cleaning through controlled friction without applying excessive mechanical stress that could damage the bond collet tip.

Inventive Principle:

Principle #35Parameter changes

4Reliability

If cleaning is performed at fixed intervals, then bond collet cleanliness is maintained, but frequent machine stoppages reduce productivity

Engineering Contradiction:

Improvebond collet cleanlinessVSAvoidmachine downtime

Core Design Contradiction:

ReliabilityVSLoss of time

Solution Approach 1:

The cleaning action is integrated into the continuous operation of the die bonder, occurring automatically during each cycle when the bond collet moves between positions. This eliminates discrete cleaning interruptions and maintains continuous productive operation while ensuring bond collet cleanliness.

Inventive Principle:

Principle #20Continuity of useful action

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution reduces cleaning time, enhances bond collet surface cleanliness, and minimizes the risk of damage during the cleaning process, thereby improving the overall productivity and quality of the die bonding process.

Implementation Method 1

a cleaning agent supply operative to provide a cleaning agent to the cleaning surface to facilitate the cleaning of the bond collet

Methodology Applied

Scientific EffectChemical cleaning:

Implementation Method 2

the cleaning surface comprises a textile material

Methodology Applied

Scientific EffectCapillary action: Capillary Action

Data Source

PatentUS9318362B2Die bonder and a method of cleaning a bond collet

Publication Date: 2016.04.19 ASMPT SINGAPORE PTE LTD

AI summary

A die bonder comprises a movable bond collet for holding an electronic device, and a platform which comprises a cleaning surface for cleaning the bond collet when the bond collet contacts the cleaning surface. The die bonder also comprises a cleaning agent supply, wherein the cleaning agent supply is operative to provide a cleaning agent to the cleaning surface to facilitate the cleaning of the bond collet.