Die Bonder Bond Head Decoupling for Precision
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Solution Overview
Problem
Conventional die bonders face challenges in achieving high placement accuracy and preventing die tilting due to structural deformation and roll, pitch, and yaw errors when applying large bonding forces, which affects the precision of die bonding.
Innovation Solution
A die bonder design featuring a bond head with a collet driven by a linear motor and a rotary motor, decoupled from the z-axis motion, allowing for precise theta compensation and direct application of bonding force through a bond force decoupling shaft, reducing structural deformation and placement errors.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Force
If a preloaded compression spring is used to provide bonding force, then a large bonding force can be achieved, but structural deformation and placement errors occur
Solution Approach 1:
The system is divided into independent functional modules: the bond head for applying bonding force, the z-axis motion table for positioning, and the rotary motor for theta compensation. Each module operates independently to avoid interference between functions.
Solution Approach 2:
The bonding force generation function is extracted from the z-axis motion table and placed in a dedicated bond head with its own actuator. This separates the force application path from the positioning path, preventing force-induced deformation of the motion table.
2Manufacturing precision
If a pneumatic cylinder is used to provide bonding force, then structural deformation is avoided, but theta motion compensation cannot be performed
Solution Approach 1:
The bond head is designed as a multi-functional unit that can both apply bonding force through its actuator and perform theta motion compensation through the integrated rotary motor. This single component handles multiple functions that were previously distributed across separate systems.
Solution Approach 2:
The bonding force actuator and rotary compensation motor are merged into a single bond head assembly. This integration allows both force application and rotational compensation to occur at the same location without interfering with each other or with the z-axis motion table.
3Force
If a large z-axis drive-in motion is created, then bonding force is increased, but roll, pitch and yaw of the z-axis motion table occur
Solution Approach 1:
The bonding force generation is extracted from the z-axis motion table system and relocated to an independent bond head. This removes the coupling between large drive-in motions and motion table stability, allowing the table to remain stable while the bond head provides the necessary bonding force.
Solution Approach 2:
The system segments the force application function from the positioning function. The z-axis motion table handles only precise positioning, while the bond head's actuator handles force application. This segmentation prevents the transmission of large forces through the motion table structure.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables accurate and precise die bonding with a large bonding force while minimizing placement errors and structural deformation, ensuring non-tilting and correcting rotary offsets, thus enhancing overall bonding precision.
Implementation Method 1
a first motor connected to the collet by a shaft for driving the collet in driving directions towards and away from the bonding site
Implementation Method 2
a rotary motor operatively connected to the collet for rotating the collet about a rotational axis that is parallel to the driving directions of the first motor
Implementation Method 3
a die bond head which has an air nozzle for creating a suction force to pick up a semiconductor die from a wafer platform holding the die
Data Source
AI summary
A die bonder is provided comprising a bond head including a collet for picking up a die and bonding the die at a bonding site. The die bonder further comprises a first motor which is connected to the collet by a shaft for driving the collet in driving directions towards and away from the bonding site and a second motor which is connected to the bond head for driving the bond head in directions parallel to the driving directions of the first motor. A rotary motor is also operatively connected to the collet for rotating the collet about a rotational axis that is parallel to the driving directions of the first motor. The shaft is slidably connected to the rotary motor and is slidable relative to the rotary motor when it is driven by the first motor to move.