Die Bonder Level Adjustment via Bond Arm Feedback
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Solution Overview
Problem
Conventional die bonding apparatuses lack feedback control, leading to unpredictable bonding levels due to changes in collet tip characteristics, resulting in varying impact forces that can damage the collet and die, reduce production throughput, and affect bonding quality.
Innovation Solution
A die bonding apparatus with a bond arm support and a measuring device, such as an encoder, that adjusts the bonding level in real-time based on the distance moved by the bond arm relative to the support, ensuring consistent bonding forces through feedback control.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If conventional die bonding apparatus without feedback control is used, then device complexity is reduced, but bonding precision deteriorates due to unpredictable bonding levels
Solution Approach 1:
The patent implements a feedback control system using a measuring device (encoder) that continuously monitors the position of the bond arm and bond arm support. The controller receives position feedback and automatically adjusts the bonding level to compensate for changes in collet tip characteristics, maintaining consistent bonding precision without requiring manual intervention or complex mechanical structures.
2Reliability
If bonding level is kept constant, then device complexity is reduced, but reliability deteriorates due to varying impact forces from collet wear and thermal expansion
Solution Approach 1:
The feedback control system continuously monitors bond arm position and automatically adjusts the bonding level to compensate for collet tip wear and thermal expansion, maintaining reliable and consistent bonding forces throughout operation without requiring complex mechanical adjustment mechanisms.
Solution Approach 2:
The patent transitions from a static bonding level to a dynamic adjustment system where the bonding level is automatically modified in real-time based on feedback from the measuring device, allowing the system to adapt to changing conditions while maintaining reliability.
3Productivity
If manual bonding level adjustment is used, then device complexity is reduced, but productivity deteriorates due to frequent stopping for adjustment
Solution Approach 1:
The automatic feedback control system eliminates the need for manual intervention by continuously monitoring bond arm position and self-adjusting the bonding level, allowing continuous operation without stopping for adjustments and thereby maximizing productivity.
Solution Approach 2:
The system performs self-adjustment of the bonding level using the feedback from the measuring device and the controller, eliminating the need for operator intervention and enabling continuous uninterrupted production.
4Measurement precision
If no measurement device is added, then device complexity is reduced, but measurement precision deteriorates due to inability to detect bond arm position changes
Solution Approach 1:
The patent replaces manual observation and mechanical indicators with an electronic measuring device (encoder) that provides precise digital measurement of bond arm position, enabling accurate detection of position changes while integrating seamlessly into the existing control system.
Data Source
AI summary
A die bonding apparatus and method is provided to automatically adjust a level of a die bonder to compensate for any physical changes occurring in the die bonder during bonding. A bond arm support is drivable to a bonding level to position a die onto a bonding surface, and a bond arm is slidably mounted to the bond arm support for holding and bonding the die. The bond arm is configured to be urged by the bonding surface to move relative to the bond arm support upon contact of the die onto the bonding surface. A measuring device is provided for determining a distance moved by the bond arm relative to the bond arm support during bonding, and a controller is responsive to the distance determined by the measuring device to change the bonding level to which the bond arm support is driven.