Die Bonder Dual-Stage Positioning for Thermal Drift
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Solution Overview
Problem
In semiconductor manufacturing, high-temperature die bonding processes face challenges with precise positioning due to thermal expansion and radiant heat, leading to misregistration issues that existing technologies struggle to accurately address, especially with the miniaturization of dies and advancements in three-dimensional packaging.
Innovation Solution
A die bonder equipped with a bonding head, a positioning mechanism featuring a first and second adjustment mechanism, a positioning controller, and actuators such as piezo-electric or ultra-magnetostrictive devices that allow for precise positioning and fine adjustments to achieve sub-micron accuracy, along with a restoring force mechanism to correct for thermal expansion and radiant heat-induced offsets.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If high temperature heating is applied to facilitate die bonding, then bonding capability is improved, but positioning accuracy deteriorates due to thermal expansion and radiant heat
Solution Approach 1:
The positioning system is segmented into two independent mechanisms: a first adjustment mechanism for coarse positioning and a second adjustment mechanism for fine positioning. This segmentation allows the coarse mechanism to handle large thermal drifts while the fine mechanism achieves sub-micron precision, resolving the contradiction between high-temperature bonding and positioning accuracy.
Solution Approach 2:
The patent implements dynamic compensation for thermal effects by continuously monitoring and adjusting positions during the bonding process. The dual adjustment mechanisms enable real-time correction of thermal expansion and radiant heat-induced drift, maintaining positioning accuracy despite high-temperature conditions.
2Productivity
If miniaturization of die is pursued to enhance integration, then device density is improved, but positioning accuracy requirements become more stringent
Solution Approach 1:
The patent replaces conventional mechanical positioning systems with a hybrid system incorporating piezo-electric or ultra-magnetostrictive actuators. These actuators provide sub-micron resolution and repeatability required for miniaturized die, enabling precise positioning without increasing mechanical complexity.
Solution Approach 2:
The patent changes the resolution parameter of the positioning system by introducing a second adjustment mechanism with sub-micron capability. This parameter change enables accurate positioning of miniaturized die while maintaining compatibility with existing bonding processes.
3Adaptability or versatility
If three-dimensional packaging technology is implemented to enhance functionality, then integration capability is improved, but positioning accuracy requirements increase to a few micrometers
Solution Approach 1:
The positioning system is divided into coarse and fine adjustment mechanisms, where the fine adjustment mechanism specifically addresses the sub-10-micron precision requirements of 3D packaging technologies like TSV. This segmentation enables support for advanced packaging without compromising positioning accuracy.
4Measurement precision
If reference member is used to detect offset amount, then correction capability is improved, but thermal expansion of substrate and bonding stage still causes misregistration
Solution Approach 1:
The patent implements a feedback control system where the reference member detects offset amounts and feeds this information to the positioning controller. The controller then adjusts the bonding head position using the dual adjustment mechanisms, continuously compensating for thermal expansion and maintaining accurate bonding positions.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables accurate die bonding with a few micrometer precision, effectively addressing misregistration issues and ensuring reliable semiconductor manufacturing by utilizing a combination of coarse and fine adjustment mechanisms to counteract thermal expansion and radiant heat effects.
Implementation Method 1
the actuator is one of a piezo-electric device and an ultra-magnetostrictive device
Implementation Method 2
the actuator is one of a piezo-electric device and an ultra-magnetostrictive device
Implementation Method 3
there is provided a restoring force means that generates restoring force for restoring the displacement from directions opposite to the plural directions
Data Source
AI summary
The present invention provides a reliable die bonder that can accurately bond a die and a semiconductor manufacturing method. The present invention is provided with a bonding head that adsorbs a die from a wafer and bonds it to a substrate, a positioning mechanism that is provided with a first adjustment mechanism that positions a position of the die at predetermined accuracy, and positions the bonding head, a positioning controller that controls the positioning mechanism and a second adjustment mechanism that is provided to the bonding head, and adjusts a position of the die at higher accuracy than the first adjustment mechanism.