Die Bonder Tossing Control for Stable Pick-Up
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Solution Overview
Problem
The existing die bonding technologies face instability and high failure rates during the pick-up process due to varying tension in the dicing film, especially as dies become thinner, leading to inconsistent pick-up operations.
Innovation Solution
A method and device that utilize a mapping table to determine and adjust the tossing amount based on the measured tension of the dicing film, ensuring consistent tension and accurate pick-up by incorporating a position recognition unit and a drive unit to adjust the tossing force, thereby improving pick-up stability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If a constant tossing amount is used for all dies, then the pick-up process is simple to control, but the pick-up operation becomes unstable due to varying dicing film tension at different wafer positions
Solution Approach 1:
The patent applies dynamics by making the tossing amount adjustable based on die position. The system transitions from a static constant tossing amount to a dynamic variable tossing amount that adapts to the local dicing film tension at each position, thereby improving pick-up reliability while maintaining operational simplicity through automated control.
Solution Approach 2:
The patent implements local quality by applying different tossing amounts to different regions of the wafer. Each die position receives a customized tossing amount tailored to its specific dicing film tension characteristics, with center region dies receiving different tossing parameters than peripheral region dies, thus optimizing pick-up stability across the entire wafer surface.
2Reliability
If multiple tossing pins with different heights are used, then the stripping capability is enhanced, but the device complexity increases
Solution Approach 1:
The patent applies parameter changes by modifying the tossing amount parameter based on die position rather than changing the physical structure of the tossing pins. The system maintains a simple pin structure but varies the operational parameter (tossing amount) to adapt to different dicing film tensions, thereby improving stripping capability without increasing device complexity.
3Productivity
If the dicing film tension is not compensated, then the pick-up process is fast, but many pick-up mistakes occur due to position-dependent tension variations
Solution Approach 1:
The patent applies preliminary action by pre-calculating and storing the optimal tossing amount for each die position in a mapping table before the pick-up process begins. This pre-prepared position-tossing amount correspondence data allows the system to quickly retrieve and apply the correct tossing parameter without real-time calculation, thereby maintaining high pick-up speed while ensuring high pick-up accuracy through compensated tension variations.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution ensures reliable and stable pick-up of dies without failure, maintaining consistent tension and reducing variations in the pick-up process, even for thin dies, by dynamically adjusting the tossing amount according to the position and tension of the dicing film.
Implementation Method 1
adsorbing the die by means of a collet
Data Source
AI summary
When a die to be stripped out of plural dies (semiconductor chips) bonded to a dicing film is to be tossed and stripped from the dicing film, the dicing film corresponding to predetermined positions out of the peripheral portion of the die is tossed to form stripping start points. The dicing film corresponding to portions other than the above predetermined positions is then tossed to strip the die from the dicing film.