Die Bonding Cleaning Head Air Curtain for Foreign Body Containment

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Solution Overview

Problem

In die bonding processes, the diffusion of foreign bodies during cleaning can lead to contamination and reduced adhesive strength, necessitating a solution to prevent their spread and maintain cleanliness effectively.

Innovation Solution

A die bonding apparatus with a cleaning head featuring a suction aperture sandwiched between blowout openings, which directs air perpendicular and aslant to the substrate surface, forming an air curtain to contain and remove foreign bodies without allowing them to diffuse to cleaned areas.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Adaptability or versatility

If the space between the cleaning nozzle and the substrate is widened to accommodate multilayering and warps, then the cleaning capacity decreases, but the adaptability to multilayered substrates improves

Engineering Contradiction:
Improveadaptability to multilayered substratesVSAvoidcleaning capacity
Core Design Contradiction:
Adaptability or versatilityVSProductivity

Solution Approach 1:

The cleaning nozzle is divided into multiple nozzles (first nozzle, second nozzle, third nozzle) arranged in parallel, each contributing to the overall air blowout capacity. This segmentation allows the system to maintain effective cleaning distance while collectively providing sufficient air flow to handle foreign bodies on multilayered substrates.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

Multiple nozzles are combined in parallel configuration, merging their individual air blowout capacities into a collective system. This merging enables the cleaning apparatus to achieve both the required distance from the substrate and the necessary total air flow capacity for effective foreign body removal.

Inventive Principle:
Principle #5Merging (Combining)

2Productivity

If the air blowout amount is increased to enhance foreign body removal capacity, then the cleaning effectiveness improves, but foreign bodies diffuse to already cleaned areas

Engineering Contradiction:
Improveforeign body removal capacityVSAvoidforeign body diffusion
Core Design Contradiction:
ProductivityVSObject-generated harmful factors

Solution Approach 1:

Each nozzle is positioned and oriented to create a localized air flow pattern that directs foreign bodies toward the suction port rather than allowing them to diffuse laterally. The third nozzle, in particular, is oriented at an angle to specifically address foreign bodies that might otherwise spread to already cleaned areas.

Inventive Principle:
Principle #3Local quality

Solution Approach 2:

The suction port acts as an intermediary element positioned between the nozzles and the substrate surface, capturing foreign bodies before they can diffuse to already cleaned areas. This mediator redirects the air flow to contain and remove foreign bodies systematically.

Inventive Principle:
Principle #24Intermediary (Mediator)

3Ease of manufacture

If a single cleaning nozzle is used, then the device complexity is low, but the cleaning effectiveness on multilayered substrates is insufficient

Engineering Contradiction:
Improvedevice complexityVSAvoidcleaning effectiveness
Core Design Contradiction:
Ease of manufactureVSProductivity

Solution Approach 1:

The single nozzle is segmented into multiple nozzles (first, second, and third nozzles) with different orientations and positions. This segmentation allows each nozzle to target specific areas and types of foreign bodies on multilayered substrates, significantly improving cleaning effectiveness while maintaining relatively simple device architecture.

Inventive Principle:
Principle #1Segmentation

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This configuration effectively prevents foreign body diffusion, ensuring clean surfaces and reducing the need for increased air blowout strength, thus minimizing equipment size and cost.

Implementation Method 1

a suction aperture (105) having a first side and a second side extend in the first direction in a planar view, the suction aperture (105) being disposed between a blowout opening (101b) of the first nozzle (101) and a blowout opening (102b) of the second nozzle (102) while being located near to the both blowout openings

Methodology Applied
Scientific EffectSuction: Suction

Implementation Method 2

The blowout opening of the first nozzle is configured to extend along the first side of the suction aperture in a planar view, and is also configured to extend perpendicularly to a surface of the substrate. The blowout opening of the second nozzle is configured to extend along the second side of the suction aperture in a planar view, and is also configured to extend aslant toward the suction aperture

Methodology Applied
Scientific EffectAir blowout: Jet

Data Source

PatentUS12053806B2Die bonding apparatus, cleaning head and manufacturing method for semiconductor device
Publication Date: 2024.08.06 FASFORD TECH
  • US12053806B2 patent drawing
  • US12053806B2 patent drawing
  • US12053806B2 patent drawing

AI summary

A die bonding apparatus includes: a transfer section for transferring a substrate on which a die is to be mounted in a first direction; a cleaning head including a first nozzle, a second nozzle, and a suction aperture; and a drive section that moves the cleaning head in a second direction. The suction aperture first and second sides extend in the first direction in a planar view, and is disposed between blowout openings of the first nozzle and the second nozzle. The blowout opening of the first nozzle extends along the first side of the suction aperture in a planar view, and perpendicularly to a surface of the substrate. The blowout opening of the second nozzle extends along the second side of the suction aperture in a planar view, and aslant toward the suction aperture rather than perpendicularly to the surface of the substrate.