Die Bonding Tool Head Layout to Prevent Edge Air Pockets
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Solution Overview
Problem
The semiconductor industry faces challenges in achieving reliable bonding between semiconductor IC dies and target substrates due to natural warping of IC dies, which can lead to air pockets and defective bonds, particularly at the peripheral edges and corners, resulting in reduced device yields.
Innovation Solution
A die bonding tool with a tool head featuring a plurality of openings of non-uniform cross-sectional areas is used to secure and release the IC die, applying a suction force that keeps the die flat and prevents air pockets by gradually releasing the IC die from the center to the periphery, ensuring better contact with the substrate.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a conventional bonding tool is used to bond semiconductor IC dies to substrates, then the bonding process can be completed, but air pockets form at peripheral edges and corners due to die warping, resulting in defective bonds and reduced device yields
Solution Approach 1:
The patent applies local quality by using openings of non-uniform cross-sectional areas in the tool head, where openings at peripheral edges and corners have larger areas than those at central regions. This creates localized stronger suction forces at the periphery to counteract die warping and prevent air pocket formation, directly addressing the bonding integrity problem.
2Ease of operation
If uniform suction force is applied across the entire die surface, then the die can be secured to the tool head, but air pockets form at peripheral edges and corners during bonding, reducing device yields
Solution Approach 1:
The patent implements local quality by varying the suction force distribution across the die surface through non-uniform opening areas. The tool head provides stronger suction at peripheral edges and corners (larger openings) compared to central regions (smaller openings), enabling both secure die handling and prevention of air pocket formation during bonding.
3Productivity
If the IC die is released uniformly from the tool head, then the die can be transferred to the substrate, but air pockets form due to warping, leading to defective bonds
Solution Approach 1:
The patent applies local quality by creating a gradient in opening areas that produces non-uniform suction forces. During release, the larger peripheral openings allow air to escape more efficiently from edge regions first, enabling the die to conform to the substrate surface and bond uniformly without air pocket formation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach improves the integrity of the bonding process by preventing air pockets and enhancing device yields by maintaining the IC die in a flat position and facilitating uniform contact with the substrate.
Implementation Method 1
a vacuum source fluidly coupled to the plurality of openings in the lower surface and configured to selectively generate a suction force at each of the plurality of openings to temporarily secure a semiconductor IC die against the lower surface
Implementation Method 2
the tool head is configured to apply a compressive force on the semiconductor IC die to bond the semiconductor IC die to a substrate
Data Source
AI summary
A die bonding tool having a tool head including a plurality of openings fluidly coupled to a vacuum source to selectively secure a semiconductor die onto the tool head via the application of a suction force. The plurality of openings have non-uniform cross-sectional areas, including one or more first openings having a first cross-sectional area and one or more second openings having a second cross-sectional area that is greater than the first cross-section area. A first minimum offset distance between each of the first openings and any peripheral edge of the tool head is less than a second minimum offset distance between each of the second openings and any peripheral edge of the tool head. The configuration of the openings in the tool head may improve bonding of the semiconductor die to a substrate by inhibiting air becoming trapped between the semiconductor die and the substrate during the bonding process.