Die Bonding Structure With Aligned Sealing Rings
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Solution Overview
Problem
The semiconductor industry faces challenges in achieving efficient die bonding between dies of different sizes and layouts, with existing methods often resulting in poor bonding quality and increased risk of delamination due to misalignment and material mismatch.
Innovation Solution
A die bonding structure is developed, where first and second dies are bonded using metal contacts and sealing rings made of Cu and SiN/SiCN respectively, with a hybrid bonding process involving laser cutting and thermal pressing to ensure direct and strong bonding, and the dies are laterally bonded with controlled pitch joints.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional die bonding methods are used for dies of different sizes and layouts, then bonding can be achieved, but bonding quality deteriorates and delamination risk increases due to misalignment and material mismatch
Solution Approach 1:
The patent changes the material parameters of the sealing rings to match between different dies (both made of SiN or both of Cu), eliminating material mismatch. This parameter change ensures consistent thermal expansion coefficients and bonding characteristics, thereby improving bonding quality and reducing delamination risk when bonding dies of different sizes and layouts
Solution Approach 2:
The patent introduces sealing rings as intermediary elements that facilitate precise alignment during bonding. The sealing rings with matching materials act as mediators between different dies, providing a consistent bonding interface that compensates for size and layout differences, thus improving alignment precision and bonding reliability
2Strength
If conventional bonding methods are used, then bonding can be achieved, but bonding strength is insufficient due to material mismatch
Solution Approach 1:
The patent modifies the material parameters of sealing rings to ensure matching between different dies. By making sealing rings from the same material (both SiN or both Cu), the thermal expansion coefficients and bonding properties are standardized, resulting in stronger bonds and reduced delamination risk
Solution Approach 2:
The patent applies homogeneity by ensuring that sealing rings from different dies are made of the same material composition. This material uniformity creates consistent bonding interfaces with matched thermal and mechanical properties, thereby enhancing bonding strength and reliability across dies of different sizes and layouts
3Manufacturing precision
If laser cutting is used for wafer preparation, then sidewall alignment is improved, but the process complexity increases
Solution Approach 1:
The patent replaces conventional mechanical cutting methods with laser cutting technology. This substitution uses optical energy (laser) instead of mechanical contact to cut wafers and create precise sidewalls. The laser cutting process achieves superior sidewall alignment and smoothness without mechanical tool wear or contact, justifying the increased process complexity through significantly improved manufacturing precision
4Strength
If hybrid bonding process is used, then bonding strength is improved, but the manufacturing process becomes more complex
Solution Approach 1:
The patent optimizes bonding parameters including temperature, pressure, and time profiles in the hybrid bonding process. By carefully controlling these parameters and using pre-aligned structures from laser cutting, the process achieves strong bonding while managing complexity through parameter optimization rather than process simplification
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach results in a robust and reliable die bonding structure with improved bonding strength and reduced risk of delamination, enabling efficient integration of dies with different sizes and layouts, and facilitating smooth sidewalls for enhanced hybrid bonding processes.
Implementation Method 1
The first wafer is cut by performing a laser cutting, and the laser cutting aligns a sidewall of the first sealing ring
Implementation Method 2
a hybrid bonding process involving laser cutting and thermal pressing to ensure direct and strong bonding
Data Source
AI summary
A die bonding structure includes a first die and a second die. The first die includes a first sealing ring and a plurality of first metal contacts, wherein sidewalls of the first metal contacts align a sidewall of the first sealing ring. The second die includes a second sealing ring and a plurality of second metal contacts, wherein sidewalls of the second metal contacts align a sidewall of the second sealing ring. The first metal contacts are directly bonded to the second metal contacts, respectively, and the first sealing ring is directly bonded to the second sealing ring.