Die Bonding Structure With Alignment Cavities for Misplacement Tolerance
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Solution Overview
Problem
Misalignment of microelectronic dies during bonding processes leads to yield loss and interference with neighboring dies, particularly in direct bonding where misplacement occurs before further processing can correct it.
Innovation Solution
Implementing protrusions and cavities with tolerances to accommodate misalignment, along with alignment guide regions, to ensure proper alignment and prevent interference during direct bonding.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If direct bonding is used to assemble microelectronic dies, then robust connections and greater density of connections are achieved, but manufacturing yield deteriorates due to misalignment issues
Solution Approach 1:
Alignment guide regions are formed on the bonding surfaces before the actual bonding process. These guide regions include protrusions and cavities that pre-establish the correct alignment position, ensuring that when bonding occurs, the dies are properly aligned from the start, preventing misalignment-related yield loss
Solution Approach 2:
The alignment guide regions act as an intermediary mechanism between the bonding surfaces. The protrusions on one die fit into the cavities on the other die, serving as a mechanical mediator that guides and maintains proper alignment during the bonding process, thereby improving manufacturing yield while preserving connection robustness
2Loss of time
If misaligned dies are allowed to remain during bonding, then processing time is reduced, but yield loss increases due to interference with neighboring dies
Solution Approach 1:
The alignment guide regions with protrusions and cavities create a preliminary anti-action against misalignment. The mechanical interlocking feature prevents dies from being misplaced during bonding, automatically correcting or preventing alignment issues before they can interfere with neighboring dies, thus maintaining both processing efficiency and manufacturing yield
Data Source
AI summary
Disclosed is a bonded structure including a first microelectronic structure with a first bonding surface and a second microelectronic structure with a second bonding surface directly bonded to the first bonding surface. The first microelectronic structure includes at least one cavity a through the first bonding surface. The second microelectronic structure includes at least one protrusion extending above the second bonding surface. The at least one protrusion of the second microelectronic structure extends within the at least one cavity of the first microelectronic structure without reaching a bottom of the at least one cavity.