Die Bonding Alignment Mark Correction for Precise Hybrid Placement

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Solution Overview

Problem

Advanced packaging technologies face challenges in achieving high throughput and precise placement of chips, particularly in hybrid bonding where small misalignment tolerances and low overlay accuracy pose significant issues.

Innovation Solution

A bonding method that includes providing a source substrate with active side alignment marks and non-active side alignment marks, determining alignment marks placement errors based on offsets between these marks, and using this information to adjust the position and orientation of the die chuck for precise placement.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of manufacture

If passive alignment is used in flip chip to wafer bonding, then the bonding process is simple, but the placement accuracy deteriorates (>200 nm error)

Engineering Contradiction:

Improvebonding process simplicityVSAvoidplacement accuracy

Core Design Contradiction:

Ease of manufactureVSManufacturing precision

Solution Approach 1:

The patent performs alignment mark detection and calculates placement errors before the actual bonding process. By detecting the positions of alignment marks on both the substrate and chip in advance, and computing the offset between them, the system prepares correction data that will be applied during bonding to achieve high precision without complex real-time adjustments

Inventive Principle:

Principle #10Preliminary action

Solution Approach 2:

The patent implements a feedback mechanism where the detected positions of alignment marks are used to calculate placement errors, which then feed back to adjust the bonding process. The system uses the measured offsets between substrate and chip alignment marks to correct placement deviations, enabling high precision bonding through iterative measurement and correction

Inventive Principle:

Principle #23Feedback

2Productivity

If high throughput placement is pursued, then productivity increases, but placement precision deteriorates

Engineering Contradiction:

ImprovethroughputVSAvoidoverlay accuracy

Core Design Contradiction:

ProductivityVSManufacturing precision

Solution Approach 1:

The system performs alignment mark detection and placement error calculation before the bonding operation, preparing all necessary alignment data in advance. This preliminary measurement and computation enables high-speed bonding execution without sacrificing precision, as the correction parameters are already determined

Inventive Principle:

Principle #10Preliminary action

Solution Approach 2:

The patent replaces complex mechanical alignment adjustment mechanisms with an optical detection and computational correction system. By using optical sensors to detect alignment mark positions and computing placement errors algorithmically, the system achieves high precision through information processing rather than mechanical adjustment, enabling both high throughput and high accuracy

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

Data Source

PatentUS20250140592A1Method and system for die bonding

Publication Date: 2025.05.01 CANON KK

AI summary

A bonding method includes providing a source substrate, the source substrate includes active side alignment marks on an active side of the source substrate, first non-active side alignment marks and second non-active side alignment marks on a non-active side of the source substrate, and obtaining positions of the active side alignment marks and positions of the first non-active side alignment marks of the source substrate, and determining alignment marks placement errors based on offsets between the positions of the active-side alignment marks and the positions of the first non-active side alignment marks in the X, Y, and θ directions.