Die Bonding Substrate Bumpers for Misalignment Isolation
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Solution Overview
Problem
In microelectronic bonding processes, misaligned dies can interfere with neighboring dies, leading to manufacturing yield loss due to incorrect placement and function, particularly in direct bonding where dielectric materials can bond at room temperature before further processing, causing misalignment issues.
Innovation Solution
The implementation of bumper structures around bonding regions on substrates to confine and isolate misaligned dies, preventing interference with adjacent dies and enhancing manufacturing yield by restricting their movement and placement errors.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If direct bonding is used to bond dies onto a host substrate, then robust connections and greater density of connections are achieved, but misaligned dies can interfere with neighboring dies leading to manufacturing yield loss
Solution Approach 1:
The bonding substrate is segmented into multiple bonding regions separated by bumpers. Each bonding region is an isolated area where dies are intended to be placed, and the bumpers create physical divisions that prevent misaligned dies from one region from interfering with neighboring regions. This segmentation approach maintains the robust bonding capability while solving the misalignment issue by creating independent bonding zones.
Solution Approach 2:
Bumpers are introduced as intermediary structures between bonding regions. These bumpers serve as mediator elements that physically separate the bonding regions and prevent direct contact between misaligned dies from different regions. The bumpers act as a buffer zone that absorbs placement errors and prevents harmful interference between adjacent bonding areas.
2Reliability
If bumpers are added to separate bonding regions, then misaligned dies are confined and manufacturing yield is improved, but device complexity increases
Solution Approach 1:
The bumpers are formed by selectively removing material (etching) from the substrate to create recessed regions, rather than adding complex three-dimensional structures. This approach discards the need for complex bumper fabrication processes and recovers the substrate material itself to form the bumpers, thereby improving reliability while minimizing the increase in device complexity.
Solution Approach 2:
The bumpers are formed on the substrate before the die bonding process. This preliminary action of creating the separated bonding regions with bumpers ensures that when dies are placed, the misalignment issues are already mitigated by the pre-existing physical barriers. The structure is prepared in advance to handle potential placement errors, improving yield without requiring complex real-time adjustments.
Data Source
AI summary
Disclosed is a bonded structure including a substrate that includes a surface and at least one bumper extending above the surface by a bumper height. The bonded structure further includes at least one die directly bonded to the surface adjacent the bumper.