Die Bonding Transfer That Keeps Peripheral Edges Off Contact Surfaces
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Solution Overview
Problem
Electronic devices face issues with particle generation and chipping/cracking at die corners and edges during the dicing process, which complicates bonding and increases the likelihood of particles being trapped between the die and the bonding site.
Innovation Solution
A method involving creating edges on the die to prevent contact with the bonding site or chucking surface, and using a bonding apparatus with a dual-pressure actuator to bow the die away from the chucking surface during bonding, ensuring the peripheral edge does not contact the chucking surface.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the die is held on the bonding head during bonding, then the die can be positioned and bonded to the bonding site, but particles can be generated and trapped between the die and bonding site
Solution Approach 1:
The patent extracts the problematic outer peripheral edge of the die from the bonding contact area by creating a first edge that extends from the major surface to the dicing lane, preventing this edge from contacting the bonding site or chucking surface during bonding operations
Solution Approach 2:
The patent introduces an intermediary structure (the first edge created by etching) between the die and the bonding site/chucking surface, which acts as a barrier to prevent direct contact and thereby prevent particle generation and trapping
2Ease of manufacture
If dicing is performed to separate the die from the workpiece, then the die can be individually processed and bonded, but the corners and edges become rough and prone to chipping and cracking
Solution Approach 1:
The patent performs preliminary action by creating the first edge through etching before the dicing process, which strengthens the die edges and corners against the subsequent mechanical stress of dicing and handling operations
Solution Approach 2:
The patent applies beforehand cushioning by creating a protective first edge structure that cushions and protects the die from chipping and cracking during dicing and subsequent handling, before the actual dicing operation occurs
3Strength
If the chucking surface has a larger area than the die, then the die can be securely held during bonding, but more particles are generated when the die contacts the bonding head
Solution Approach 1:
The patent extracts the problematic contact area by creating a first edge that prevents the outer peripheral edge of the die from contacting the chucking surface, thereby eliminating the source of particle generation while maintaining secure holding through the larger chucking surface area
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Reduces particle generation and minimizes the risk of particle trapping, enhancing the reliability and precision of the bonding process.
Implementation Method 1
a first pressure actuator adapted to provide a first vacuum within the first zone, wherein the first vacuum is sufficient to a hold a die
Implementation Method 2
a second pressure actuator and adapted to provide a pressure to the second zone, wherein the pressure is sufficient to bow the die while the die is being held by the first vacuum within the first zone
Data Source
AI summary
In an implementation, a method can include creating a first edge in a workpiece that includes a die and a dicing lane adjacent to the die, wherein the first edge extends to at least the dicing lane. The method can further include dicing the workpiece to separate the die from a remainder of the workpiece, wherein dicing forms an outer peripheral edge and is performed after creating the first edge, and bonding the die to a bonding site, wherein, during bonding, the outer peripheral edge does not contact an object. In another implementation, the bonding substrate can comprise a trench, and the die may or may not have an edge. In both methods, outer peripheral edges of the die may not contact any object during a bonding transfer cycle. A bonding apparatus can be adapted to carry out the method.