Die Bonding Device Ejector Buffer and Collet Replacement
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Current die bonding processes face inefficiencies in attaching dies to substrates and require frequent replacement of die ejectors and collets, which can be time-consuming and disrupt the semiconductor packaging process.
Innovation Solution
A die bonding device is designed with a wafer holder, ejector holder, support unit, bonding unit, ejector buffer unit, and replacing unit, featuring a plate-shaped ejector buffer member with fixing members and an electromagnet, and a collet buffer member with test unit and magnet, allowing for efficient die attachment and easy replacement of die ejectors and collets.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If a die ejector is used to separate the die from the wafer, then the die bonding process can proceed, but the die ejector requires frequent replacement which disrupts the process
Solution Approach 1:
The ejector buffer unit stores multiple die ejectors in advance, allowing the bonding unit to quickly retrieve a replacement ejector without interrupting the die bonding process. This preliminary preparation of spare ejectors eliminates downtime associated with ejector replacement.
Solution Approach 2:
The ejector buffer unit acts as an intermediary between the ejector holder and the bonding unit, temporarily storing and managing multiple die ejectors. This intermediary system facilitates smooth transitions when ejectors need replacement, maintaining continuous operation.
2Manufacturing precision
If a collet is used to hold the die during bonding, then precise positioning is achieved, but the collet requires frequent replacement which reduces operational efficiency
Solution Approach 1:
The collet buffer member stores multiple collets in advance, enabling the bonding unit to quickly swap collets without interrupting the die bonding operation. This preliminary stocking of spare collets ensures that precise positioning capability is maintained while minimizing replacement time.
Solution Approach 2:
The collet buffer member serves as an intermediary storage system between the bonding unit and external supply, managing multiple collets and facilitating rapid exchanges. This intermediary buffer maintains operational continuity while preserving positioning precision.
3Ease of manufacture
If manual replacement of die ejectors and collets is performed, then component replacement is possible, but the process is time-consuming and labor-intensive
Solution Approach 1:
The bonding unit autonomously manages the replacement of die ejectors and collets by retrieving them from their respective buffer units without external intervention. This self-service mechanism eliminates manual labor and significantly reduces replacement time, making the process both easier and faster.
Solution Approach 2:
The system replaces manual mechanical replacement operations with an automated mechanical system. The bonding unit uses automated mechanisms to retrieve and install die ejectors and collets from buffer units, substituting human-operated mechanical processes with machine-controlled ones.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The device enhances the efficiency of die attachment to substrates and simplifies the replacement process for die ejectors and collets, improving the overall semiconductor packaging process by ensuring precise positioning and secure attachment.
Implementation Method 1
The fixing member may protrude from a top of the ejector buffer member and may include an electromagnet
Implementation Method 2
The collet buffer member may include a magnet disposed adjacent to the receiving recess
Data Source
AI summary
A die bonding device includes: a wafer holder supporting a wafer where a die is formed; an ejector holder disposed at the wafer holder below the wafer and supporting a die ejector that assists separating the die from the wafer; a support unit supporting a substrate where the die is to be attached; a bonding unit that picks up the die from the wafer and attaches the picked-up die to the substrate; an ejector buffer unit that receives the die ejector; and a replacing unit that transfers the die ejector between the ejector holder and the ejector buffer unit.