Dicing/Die-Bonding Film Evaluation for Small-Chip Pickup
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
The adhesive layer of dicing/die-bonding integrated films faces challenges in achieving optimal adhesive force for both dicing and pickup processes, particularly with small chips, leading to issues like peeling, flying chips, and reduced yield due to insufficient or excessive adhesive strength.
Innovation Solution
A method for evaluating and sorting dicing/die-bonding integrated films by measuring edge peeling strength, ensuring the adhesive layer has a strength of 1.2 N or less, and adjusting properties like viscosity and elasticity to optimize adhesive force for small chips, thereby improving pickup performance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the adhesive force of the adhesive layer is increased to prevent peeling during dicing, then dicing process stability is improved, but pickup property deteriorates due to excessive adhesion preventing chip separation
Solution Approach 1:
The adhesive layer is designed with non-uniform adhesive force distribution: the central region maintains high adhesive force to prevent peeling during dicing, while the peripheral region has reduced adhesive force to enable easy chip separation during pickup. This spatial differentiation of adhesive properties resolves the contradiction between dicing stability and pickup ease.
Solution Approach 2:
The adhesive force of the adhesive layer is dynamically controlled by changing the degree of ultraviolet irradiation. By adjusting irradiation dose and duration, the adhesive force can be optimized to achieve appropriate balance between preventing peeling during dicing and enabling separation during pickup, thus resolving the contradiction through parameter optimization.
2Ease of operation
If the adhesive force of the adhesive layer is decreased to improve pickup property, then chip separation becomes easier, but peeling occurs during dicing causing flying chips and reduced yield
Solution Approach 1:
The adhesive layer exhibits spatially differentiated adhesive properties where the center maintains strong adhesion for dicing stability while the periphery has weaker adhesion for easy pickup. This local quality differentiation ensures both dicing reliability and pickup ease without compromise.
Solution Approach 2:
The adhesive layer is pre-irradiated with ultraviolet rays to establish appropriate adhesive force characteristics before the dicing process. This preliminary action ensures that the adhesive layer has the correct balance of strength and releasability built-in, preventing both peeling during dicing and ensuring easy pickup later.
3Device complexity
If conventional pickup evaluation methods are used, then evaluation process remains simple, but accurate assessment of small chip pickup performance is impossible due to edge peeling effects
Solution Approach 1:
The evaluation method separately assesses central adhesion strength and peripheral edge adhesion strength independently. By differentiating between core and edge regions, the method accurately captures the localized adhesive behavior that affects small chip pickup, achieving precise measurement without excessive complexity.
Solution Approach 2:
The evaluation method uses a simplified test structure that replicates the essential adhesive behavior of the actual dicing/die-bonding film. This copying approach allows accurate prediction of small chip pickup performance through a simpler, more manageable evaluation process.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method allows for efficient selection and use of films with improved pickup properties, reducing peeling and breakage of small chips, enhancing yield in semiconductor device manufacturing.
Implementation Method 1
the adhesive force of the adhesive layer with respect to the bonding adhesive layer is weakened by irradiating the adhesive layer with ultraviolet rays
Data Source
AI summary
A method for evaluating pickup property of a dicing/die-bonding integrated film including a base layer, an adhesive, and a bonding adhesive layer in order, the method including preparing a laminate including the dicing/die-bonding integrated film and a wafer having a thickness of 10 to 100 μm laminated on the bonding adhesive layer, singulating the wafer into a plurality of chips having an area of 9 mm2 or less, pushing a center portion of the chip from a side of the base layer, and measuring a peeling strength when an edge of the chip is peeled off from the adhesive layer.