Die Bonding Holder Control to Prevent Fall and Misalignment
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Solution Overview
Problem
Bonding errors between dies and substrates in bonding apparatuses often result in misalignment, defective products, die fall, and apparatus failure, with existing methods failing to address die peeling during bonding operations.
Innovation Solution
A bonding apparatus with a first holder to suck and hold the die, a second holder to hold the substrate, and a driving mechanism to control the holders' proximity and separation, along with a controller to manage the holding force, ensuring precise alignment and preventing die fall by adjusting the holding force during separation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the holding force is increased to prevent die fall, then the reliability improves, but the die may become misaligned or damaged during the bonding process
Solution Approach 1:
The holding force is made dynamic by adjusting it according to the operational phase. During the approximating operation, a first holding force is applied to prevent die fall. During the separating operation, a second holding force (different from the first) is applied to maintain alignment while preventing die fall. This dynamic adjustment resolves the contradiction between preventing die fall and maintaining alignment accuracy.
2Productivity
If the separating operation is performed without holding force to allow die release, then the productivity improves, but the die may fall or become misaligned if bonding fails
Solution Approach 1:
The holding force is dynamically adjusted during the separating operation. Instead of completely releasing the die, a second holding force is maintained during separation to prevent die fall in case of bonding failure. After successful bonding is confirmed, the holding force is then released. This resolves the contradiction between maintaining productivity and ensuring reliability.
Solution Approach 2:
The system prepares for potential bonding failure by maintaining a second holding force during the separating operation. This beforehand cushioning ensures that if bonding fails, the die will not fall or become misaligned. Only after confirming successful bonding does the system release the holding force, thus preventing problems before they occur.
3Reliability
If the holding force is continuously applied to ensure die security, then the reliability improves, but the die bonding quality may deteriorate due to excessive force
Solution Approach 1:
The holding force is dynamically adjusted based on the operational phase. During the approximating operation, a first holding force is applied to secure the die. During the separating operation, a second holding force (different from the first) is applied. This dynamic adjustment ensures die security while preventing excessive force from deteriorating bonding quality.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The apparatus effectively reduces misalignment and prevents die fall by controlling the holding force during separation, enhancing productivity and reducing defects in the bonding process.
Implementation Method 1
a first holder configured to suck and hold the first object
Data Source
AI summary
A bonding apparatus that bonds a first object and a second object is provided. The apparatus includes a first holder configured to suck and hold the first object, a second holder configured to hold the second object, a driving mechanism configured to perform an approximating operation of moving the first holder and the second holder close to each other to bring the first object and the second object into contact with each other, and a separating operation of moving the first holder and the second holder away from each other after the approximating operation, and a controller configured to control an operation of the driving mechanism and a holding force of the first object by the first holder. The controller controls the driving mechanism to perform the separating operation while applying the holding force to the first object by the first holder.


