Die Bonding Hot Air Pre-Heating Adhesion
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Solution Overview
Problem
The die bonding process in chip manufacturing often results in low yields due to inadequate adhesive adherence, and applying heat after placing the die on the substrate leads to quality control failures and decreased units-per-hour (UPH).
Innovation Solution
A bonding device and method that utilize a heating element to heat air, which is expelled through an application element with a specific arrangement of holes to apply hot air to the die, controlled by sensors and a controller to satisfy temperature, pressure, and velocity criteria, ensuring efficient bonding within a predefined time, thereby improving adhesive adherence.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If heat is applied after placing the die on the substrate, then adhesive adherence is improved, but quality control failures increase and units-per-hour decrease
Solution Approach 1:
The die is pre-heated before being placed on the substrate. The heating element applies heat to the die surface in advance, activating the adhesive properties of the die attachment material before bonding occurs. This preliminary heating action ensures proper adhesive adherence while avoiding the need for post-placement heating that would slow down production.
Solution Approach 2:
The heating process is segmented into distinct phases: pre-heating the die before placement, and optional post-heating after placement. The application element with its array of holes delivers heat in a controlled, distributed manner across the die surface, enabling precise thermal management that improves bonding without extending cycle time.
2Reliability
If heat is applied after placing the die on the substrate, then adhesive adherence is improved, but quality control failures increase
Solution Approach 1:
Sensors detect the temperature of the die or the heated air, and the controller adjusts the heating parameters based on this feedback. The sensor provides real-time temperature data to the controller, which modulates the heating element to maintain optimal bonding conditions. This closed-loop control ensures consistent adhesive adherence while preventing overheating that would cause quality control failures.
Solution Approach 2:
The system dynamically adjusts heating parameters including temperature, duration, and spatial distribution of heat. The controller modifies these parameters based on sensor feedback and bonding requirements, optimizing the thermal process to achieve reliable adhesive adherence without exceeding thresholds that would cause quality control failures.
3Productivity
If the bonding time is reduced to maintain UPH, then productivity is improved, but bonding quality may deteriorate
Solution Approach 1:
By pre-heating the die before placement, the system eliminates or reduces the need for extended post-bonding heat treatment. The adhesive is activated in advance, allowing the bonding process to complete quickly without compromising quality. This preliminary action enables short bonding times that maintain high UPH while ensuring reliable bonding.
Solution Approach 2:
The heating process is made dynamic and adaptive rather than static. The controller adjusts heating intensity and duration based on real-time sensor feedback and specific bonding requirements. This dynamic control allows the system to achieve optimal bonding quality in variable time periods, maintaining both productivity and reliability across different production conditions.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method achieves a high yield of die bonded to substrates, exceeding 99% by optimizing the bonding process with controlled hot air application, reducing quality control failures and maintaining satisfactory UPH.
Implementation Method 1
a heating element configured to heat air
Implementation Method 2
an air blower configured to expel the heated air through the plurality of holes of the application element
Data Source
AI summary
Methods for improved die bonding. In some embodiments, a method includes applying hot air to a die. The method also includes placing the die on a substrate after applying the hot air to the die. The method further includes waiting a predefined bonding period in order to establish a bond between the die and the substrate.